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Title:
PHOTOSENSITIVE SILICONE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/020599
Kind Code:
A1
Abstract:
Provided is a resin composition which gives a cured product of a photocurable resin having good crack resistance even when formed into a thick film, and capable of maintaining a low coefficient of linear expansion, low thermal weight loss, and a low shrinkage factor. This photosensitive silicone resin composition comprises (A) a silica particle-containing condensation reaction product and (B) a photopolymerization initiator, and is characterized in that the silica particle-containing condensation reaction product (A) is a condensation reaction product of a polysiloxane compound (a) comprising a hydrolytic condensation product of one or more silane compounds represented by the following general formula (1): R1 n1SiX1 4-n1 (wherein R1, n1, and X1 are defined in the claims) and/or the silane compound, and silica particles (b), and has a terminal structure: Si-O-Y (wherein Y is defined in the claims) which satisfies the following formula (2): 0 < [Si-O-SiR3 3] / ([Si-O-R2] + [Si-O-SiR3 3]) ≤ 1 (wherein R2 and R3 are defined in the claims), and has a photopolymerizable functional group.

Inventors:
TSUGANE, Natsumi (1-105, Kanda Jinbocho Chiyoda-k, Tokyo 01, 〒1018101, JP)
津金 菜採 (〒01 東京都千代田区神田神保町一丁目105番地 Tokyo, 〒1018101, JP)
SAITO, Hideo (1-105, Kanda Jinbocho Chiyoda-k, Tokyo 01, 〒1018101, JP)
斎藤 秀夫 (〒01 東京都千代田区神田神保町一丁目105番地 Tokyo, 〒1018101, JP)
Application Number:
JP2011/063727
Publication Date:
February 16, 2012
Filing Date:
June 15, 2011
Export Citation:
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Assignee:
Asahi Kasei E-materials Corporation (1-105, Kanda Jinbocho Chiyoda-k, Tokyo 01, 〒1018101, JP)
旭化成イーマテリアルズ株式会社 (〒01 東京都千代田区神田神保町一丁目105番地 Tokyo, 〒1018101, JP)
TSUGANE, Natsumi (1-105, Kanda Jinbocho Chiyoda-k, Tokyo 01, 〒1018101, JP)
津金 菜採 (〒01 東京都千代田区神田神保町一丁目105番地 Tokyo, 〒1018101, JP)
SAITO, Hideo (1-105, Kanda Jinbocho Chiyoda-k, Tokyo 01, 〒1018101, JP)
International Classes:
C08G77/20; C08F299/08; C08G77/14; C08L83/06; C08L83/07; G03F7/075
Domestic Patent References:
WO2006035646A12006-04-06
Foreign References:
JP2005298796A2005-10-27
JP4352847B22009-10-28
JP2851915B21999-01-27
JPH0372193B21991-11-15
JP2009102628A2009-05-14
JP4352847B22009-10-28
Other References:
See also references of EP 2604644A4
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg. 5-1, Toranomon 3-chome, Minato-k, Tokyo 23, 〒1058423, JP)
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Claims: