Title:
PHOTOSENSITIVE SILOXANE COMPOSITION, HARDENED FILM FORMED THEREFROM AND DEVICE HAVING THE HARDENED FILM
Document Type and Number:
WIPO Patent Application WO/2008/065944
Kind Code:
A1
Abstract:
It is intended to provide a photosensitive siloxane composition comprising (a) polysiloxane, (b) a quinone diazide compound, (c) a solvent and (d) one or more kinds of imidosilane compounds represented by the general formulae (1) to (3). This photosensitive siloxane composition makes it possible to provide a hardened film which suffers from little shrinkage during hardening, shows a high transparency after thermal hardening, suffers from suppressed cracking after dipping in an alkali solvent and shows an excellent adhesiveness to a baseboard. wherein R1's may be either the same or different and each represents a C1-6 alkyl, C1-6 alkoxyl, phenyl or phenoxy group or an organic group substituted thereby; R2 and R4 represent each a divalent C1-10 organic group; R3 represents a silicon-free C2-20 organic group (provided that R3 represents an organic group other than a phenyl group in the general formula (1), while R3 represents an unsaturated bond-free organic group other than an alicyclic group in the general formula (2)); and Ra represents a hydrogen atom ora silicon-free C1-20 organic group.
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Inventors:
SUWA MITSUHITO (JP)
Application Number:
PCT/JP2007/072541
Publication Date:
June 05, 2008
Filing Date:
November 21, 2007
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
SUWA MITSUHITO (JP)
SUWA MITSUHITO (JP)
International Classes:
G03F7/075; G03F7/004; G03F7/023; G03F7/085; H01L21/027; H01L21/312; H01L21/768; H01L23/522
Foreign References:
| JP2007163720A | 2007-06-28 | |||
| JPH11258787A | 1999-09-24 | |||
| JPH1010740A | 1998-01-16 | |||
| JPS5535077A | 1980-03-11 | |||
| JPH051078A | 1993-01-08 |
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