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Patent Searching and Data


Title:
PHOTOSENSITIVE SILOXANE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/157696
Kind Code:
A1
Abstract:
[Problem] To provide a photosensitive siloxane resin composition having excellent alkali solubility and photosensitivity, and a pattern formation method using the same. [Solution] Provided is a photosensitive siloxane resin composition that contains the following: a siloxane resin having a silanol group or alkoxysilyl group; a crown ether; a photosensitizing agent; and an organic solvent. A pattern is formed by coating this photosensitive composition on a substrate, subjecting the composition to image-wise exposure, treating the same with an aqueous alkaline solution and then firing.

Inventors:
SEKITO TAKASHI (JP)
YOKOYAMA DAISHI (JP)
FUKE TAKASHI (JP)
TASHIRO YUJI (JP)
NONAKA TOSHIAKI (JP)
TANAKA YASUAKI (JP)
Application Number:
PCT/JP2012/062611
Publication Date:
November 22, 2012
Filing Date:
May 17, 2012
Export Citation:
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Assignee:
AZ ELECTRONIC MATERIALS IP JAPAN K K (JP)
SEKITO TAKASHI (JP)
YOKOYAMA DAISHI (JP)
FUKE TAKASHI (JP)
TASHIRO YUJI (JP)
NONAKA TOSHIAKI (JP)
TANAKA YASUAKI (JP)
International Classes:
G03F7/004; G03F7/023; G03F7/075; H01L21/027
Foreign References:
JPH08190193A1996-07-23
JP2000191656A2000-07-11
JPH03166229A1991-07-18
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (JP)
Katsunuma Hirohito (JP)
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Claims: