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Patent Searching and Data


Title:
PHOTOSENSITIVE THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT USING SAME
Document Type and Number:
WIPO Patent Application WO/2013/172246
Kind Code:
A1
Abstract:
Provided are: a photosensitive thermoplastic resin composition which is capable of providing a molded product by melt molding and which can be crosslinked by irradiating the molded product with light; and a molded product which is obtained using the photosensitive thermoplastic resin composition. A photosensitive thermoplastic resin composition wherein a thermoplastic polymer and a photo-crosslinking agent, which is compatible with the thermoplastic polymer, are mixed. This photosensitive thermoplastic resin composition is configured such that this composition is able to be melt molded and a molded product thereof obtained by melt molding can be crosslinked by irradiation of light. A molded product is obtained by melt molding this composition into a predetermined shape, and then the molded product is photo-crosslinked by irradiation of light.

Inventors:
HASE TATSUYA (JP)
MIZOGUCHI MAKOTO (JP)
Application Number:
PCT/JP2013/063044
Publication Date:
November 21, 2013
Filing Date:
May 09, 2013
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
UNIV KYUSHU (JP)
International Classes:
C08F2/48; C08J3/28
Foreign References:
JPS55142015A1980-11-06
JPH09249721A1997-09-22
JP2002347108A2002-12-04
JP2002097216A2002-04-02
JPH0673131A1994-03-15
Attorney, Agent or Firm:
UENO, NOBORU (JP)
Ueno 登 (JP)
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