Title:
PHOTOSENSITIVE TRANSFER MATERIAL, CIRCUIT WIRING MANUFACTURING METHOD, AND TOUCH PANEL MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/155193
Kind Code:
A1
Abstract:
A photosensitive transfer material, and a circuit wiring manufacturing method and a touch panel manufacturing method that use said photosensitive transfer material, said photosensitive transfer material having: a temporary support body; and a photosensitive resin layer that includes a polymer component and a photoacid generator, said polymer component including a polymer that includes a structural unit with an acid group and a structural unit with a group in which an acid group is protected by the shape of an acetal, the average I/O value of said polymer component being 0.55 to 0.65, said I/O value being based on an organic conceptual diagram of the polymer component and being the inorganic value I divided by the organic value O, the content of the structural unit with an acid group being 0.5mass% to 15mass% with regard to the total mass of the polymer component, and the average glass transition temperature of said polymer component being 90°C or less.
Inventors:
MATSUDA TOMOKI (JP)
KATAYAMA AKIO (JP)
YAMADA SATORU (JP)
MOROZUMI KAZUMASA (JP)
FUJIMOTO SHINJI (JP)
SUZUKI MASAYA (JP)
KATAYAMA AKIO (JP)
YAMADA SATORU (JP)
MOROZUMI KAZUMASA (JP)
FUJIMOTO SHINJI (JP)
SUZUKI MASAYA (JP)
Application Number:
PCT/JP2018/004275
Publication Date:
August 30, 2018
Filing Date:
February 07, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F220/28; G03F7/004; G03F7/20; G06F3/041; H05K3/06
Domestic Patent References:
| WO2016190405A1 | 2016-12-01 |
Foreign References:
| JP2014010382A | 2014-01-20 | |||
| JP2014085643A | 2014-05-12 | |||
| JP2015118202A | 2015-06-25 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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