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Title:
PHYSICAL INGRESS PROTECTION FOR A DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/003413
Kind Code:
A1
Abstract:
Particular embodiments described herein provide for physical ingress protection for a device. A device can include a main body wherein the main body includes a mounting panel and a tamper tab located in the mounting panel, wherein the tamper tab is removably secured to a mounting panel, wherein the mounting panel and tamper tab are configured to secure the main body to a surface such that when the main body is removed from the surface, the tamper tab remains on the surface.

Inventors:
CLAPPER, Edward O. (101 East Riviera Drive, Tempe, Arizona, 85282, US)
Application Number:
US2015/038196
Publication Date:
January 05, 2017
Filing Date:
June 27, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
INTEL CORPORATION (2200 Mission College Boulevard, Santa Clara, California, 95054-1549, US)
International Classes:
G06F21/86
Attorney, Agent or Firm:
PEMBERTON, John, D. (Patent Capital Group, c/o CPA Global900 Second Avenue South, Suite 60, Minneapolis MN, 55402, US)
Download PDF:
Claims:
CLAIMS:

1. A device comprising:

a main body wherein the main body includes:

a mounting panel; and

a tamper tab located in the mounting panel, wherein the tamper tab is removably secured to the mounting panel, wherein the mounting panel and tamper tab are configured to secure the main body to a surface such that when the main body is removed from the surface, the tamper tab remains on the surface.

2. The device of Claim 1, wherein a pressure sensitive adhesive (PSA) helps secure the main body to the surface.

3. The device of Claim 2, wherein the PSA provides ingress protection for the main body to the surface.

4. The device of Claim 2, wherein a tamper tab PSA is located on the tamper tab and the tamper tab PSA is different than the PSA.

5. The device of Claim 1, further comprising:

security tape, wherein the security tape is located between the surface and the mounting panel.

6. The serviceable chassis of Claim 5, wherein the surface is transparent and the security tape is viewable through the surface.

7. An electrical device, comprising:

electronic components, wherein the electronic components are housed in a main body, wherein the main body includes:

a mounting panel; and a tamper tab located in the mounting panel, wherein the tamper tab is removably secured to the mounting panel, wherein the mounting panel and tamper tab are configured to secure the main body to a surface such that when the main body is removed from the surface, the tamper tab remains on the surface.

8. The electronic device of Claim 7, wherein a pressure sensitive adhesive (PSA) helps secure the main body to the surface.

9. The electronic device of Claim 8, wherein the PSA provides ingress protection for the main body to the surface.

10. The electronic device of Claim 8, wherein a tamper tab PSA is located on the tamper tab and the tamper tab PSA is different than the PSA.

11. The electronic device of claim 1, further comprising: security tape, wherein the security tape is located between the surface and the mounting panel.

12. The electronic device of Claim 11, wherein the surface is transparent and the security tape is viewable through the surface.

13. A method, comprising:

attaching a device to a surface, wherein the device includes:

a main body, wherein the main body includes a mounting panel; and a tamper tab located in the mounting panel, wherein the tamper tab is removably secured to the mounting panel, wherein the mounting panel and tamper tab are configured to secure the main body to a surface such that when the main body is removed from the surface, the tamper tab remains on the surface; and inspecting the device to determine if the device has been tampered with, wherein one evidence of tampering is a missing tamper tab.

14. The method of Claim 13, wherein a pressure sensitive adhesive (PSA) helps secure the main body to the surface.

15. The method of Claim 13, wherein the PSA provides ingress protection for the main body to the surface.

16. The method of Claim 13, wherein a tamper tab PSA is located on the tamper tab and the tamper tab PSA is different than the PSA.

17. The method of Claim 13, wherein inspecting the device to determine if the device has been tampered with further includes:

inspecting security tape, wherein the security tape is located between the surface and the mounting panel and is visible through the surface.

18. A system, comprising:

a main body wherein the main body includes a mounting panel; and

a tamper tab located in the mounting panel, wherein the tamper tab is removably secured to the mounting panel, wherein the mounting panel and tamper tab are configured to secure the main body to a surface such that when the main body is removed from the surface, the tamper tab remains on the surface.

19. The system of Claim 18, wherein a pressure sensitive adhesive (PSA) helps secure the main body to the surface.

20. The system of Claim 18, wherein the PSA provides ingress protection for the main body to the surface.

Description:
PHYSICAL INGRESS PROTECTION FOR A DEVICE

TECHNICAL FIELD

[0001] This disclosure relates in general to the field of device protection, and more particularly, to physical ingress protection for a device.

BACKGROUND

[0002] End users have more electronic device choices than ever before. A number of prominent technological trends are currently afoot (e.g., more computing devices, thinner computing devices, more aesthetically pleasing computing devices, etc.), and these trends are changing the electronic device landscape. One of the technological trends is to have a sleek, smooth, aesthetically pleasing device. However, manufacturing realities dictate that an electronic housing include separate and individual housing components, which upon assembly, produce seams that are problematic to aesthetics, ingress protection, device security, cost, etc.. Hence, there is a challenge in providing a sleek, smooth, aesthetically pleasing design while still allowing access to the electronics inside a computing device.

BRIEF DESCRIPTION OF THE DRAWINGS

[0003] To provide a more complete understanding of the present disclosure and features and advantages thereof, reference is made to the following description, taken in conjunction with the accompanying figures, wherein like reference numerals represent like parts, in which:

[0004] FIGURE 1A is a simplified schematic diagram illustrating side plan view of a device with physical ingress protection, in accordance with one embodiment of the present disclosure;

[0005] FIGURE IB is a simplified schematic diagram illustrating an orthographic view of a device with physical ingress protection, in accordance with one embodiment of the present disclosure; [0006] FIGURE 2A is a simplified schematic diagram illustrating an exploded orthographic view of a device with physical ingress protection, in accordance with one embodiment of the present disclosure;

[0007] FIGURE 2B is a simplified schematic diagram illustrating an exploded orthographic view of a device with physical ingress protection, in accordance with one embodiment of the present disclosure;

[0008] FIGURE 3 is a simplified schematic diagram illustrating a cutaway plan view of a portion of a device with physical ingress protection, in accordance with one embodiment of the present disclosure;

[0009] FIGURE 4 is a simplified schematic diagram illustrating a cutaway plan view of a portion of a device with physical ingress protection, in accordance with one embodiment of the present disclosure;

[0010] FIGURE 5 is a simplified schematic diagram illustrating an orthographic view of a portion of a device with physical ingress protection, in accordance with one embodiment of the present disclosure;

[0011] FIGURE 6 is a simplified schematic diagram illustrating an orthographic view of a device with physical ingress protection, in accordance with one embodiment of the present disclosure;

[0012] FIGURE 7A is a simplified schematic diagram illustrating an orthographic view of a device with physical ingress protection, in accordance with one embodiment of the present disclosure;

[0013] FIGURE 7B is a simplified schematic diagram illustrating an orthographic view of a device with physical ingress protection, in accordance with one embodiment of the present disclosure; and

[0014] FIGURE 7C is a simplified schematic diagram illustrating an orthographic view of a device with physical ingress protection, in accordance with one embodiment of the present disclosure.

[0015] The FIGURES of the drawings are not necessarily drawn to scale, as their dimensions can be varied considerably without departing from the scope of the present disclosure. DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

EXAMPLE EMBODIMENTS

[0016] The following detailed description sets forth example embodiments of apparatuses, methods, and systems relating to hinge configurations for an electronic device. Features such as structure(s), function(s), and/or characteristic(s), for example, are described with reference to one embodiment as a matter of convenience; various embodiments may be implemented with any suitable one or more of the described features.

[0017] FIGURE 1A is a simplified orthographic diagram of physical ingress protection for a device 100, in accordance with one embodiment of the present disclosure. A device 102 with physical ingress protection can include a tamper tab 106. Device 102 can be releasably secured or coupled to surface 104 using an adhesive or some other material or means to secure or couple device 102 to surface 104.

[0018] Turning to FIGURE IB, FIGURE IB is a simplified orthographic diagram of physical ingress protection for a device 100, in accordance with one embodiment of the present disclosure. As illustrated in FIGURE IB, device 102 has been removed from surface 104. When device 102 is removed from surface 104, tamper tab 106 can be left behind as in indication that device 102 was removed from surface 104. The material securing or coupling device 102 to surface 104 should be strong enough to hold device 102 on surface 104 but not so strong that device 102 cannot be removed from surface 104.

[0019] The foregoing is offered by way of non-limiting examples in which the system and method of the present specification may usefully be deployed. The following disclosure provides many different embodiments, or examples, for implementing different features of the present disclosure. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. Further, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Different embodiment many have different advantages, and no particular advantage is necessarily required of any embodiment.

[0020] The following detailed description sets forth example embodiments of apparatuses, methods, and systems relating to an attachment for devices. Features such as structure(s), function(s), and/or characteristic(s), for example, are described with reference to one embodiment as a matter of convenience; various embodiments may be implemented with any suitable one or more of the described features.

[0021] For purposes of illustrating certain example techniques of physical ingress protection for a device 100, it is important to understand the foundational information related to device 102. The following foundational information may be viewed as a basis from which the present disclosure may be properly explained.

[0022] Regulated RFID devices used for tracking vehicles in toll road systems and controlled traffic regions are required to have tamper detection and prevention features. In addition, the RFID device should provide protection from ingress of dust and/or water. In addition, enclosures often need some type of protection and to identify when ingress to the device has occurred or may have occurred. What is needed is a system and method that can provide physical ingress protection for a device.

[0023] A device 102, as outlined in FIGURES 1A and IB, can resolve these issues (and others). Device 102 may be configured to allow for electronic tamper/intrusion detection of device 102 via separation of enclosure components (e.g., tamper tab 106) that are separately mounted to a common surface (e.g., surface 104). The mounting surface and an intermediary mounting medium can help prevent or limit ingress of substances into device 102. In an example, device 102 can provide visible evidence of tamper detection thru a transparent mounting surface.

[0024] In an example, device 102 can be configured to include strategically- segmented enclosure components, combined with a specialized form and formulation of PSA (Pressure Sensitive Adhesive). The combination of the enclosure partitioning and PSA attributes allow for both tamper detection and prevention or limiting of dust and water ingress at a lower economical cost than current conventional alternatives. [0025] In an example, tamper tab 106 is a small "tab" of enclosure material disposed in a thru-hole in device 102. Tamper tab 106 can be a physically separate component, coupled to an electrically conductive element that makes contact with two pads on a circuit board inside device 106.

[0026] A pressure sensitive adhesive (PSA) (e.g., double sided tape) can be used to secure or couple the device and the tamper tab 106 to a surface 104. In an example, the PSA material can be die-cut into two separated regions. The first region is the main adhesion boundary, attaching the enclosure body to a surface such as a wall or windshield. Within that boundary is tamper tab 106. The first region of PSA contains a hole sized such that tamper tab 106 is not in contact with the first region of PSA. A second region of PSA material is sized and positioned to only be attached to the mounting face of tamper tab 106. Thus, the two regions of PSA are separate from one another and mounted to different components of the case

[0027] When an attempt is made to remove device 102 from surface 104, there is no means to access tamper tab 106 directly without damaging the s u rfa ce, the device, or the boundary PSA that holds device 102 to s u rfa ce 104. Typically, device 102 would be p u l l e d away from s u rfa ce 104, and independently-mounted tamper tab 106 would remain attached to surface 104. This event causes the tamper contact with the circuit board pads to be broken, and a tamper event ca n be electron ical ly recorded.

[0028] I ngress protection is im porta nt to the protect i o n of a device, as it both ensu res fu nction and prevents hard-to-verify tam pering methods which involve contaminating the device with dust or fluids. Device 102 can be configured such that all seams of device 102 are within the boundary of the mounting surface (e.g. surface 104). In an example, the boundary between device 102 and surface 104 can be fully covered with a PSA that includes a non-porous primary adhesion layer, a closed-cell foam center layer (if applicable), a non-porous secondary adhesion layer, and a non-porous liner affixed to the secondary adhesion layer for storage prior to installation. The non-porous primary adhesion layer of the PSA conformally covers the main seam between the main case body and the mounting panel, providing a reliable ingress barrier. Without this approach, this seam would need to be sealed using other methods such as gaskets, glues or ultrasonic welding in addition to PSA being needed to attach the device. These alternative methods are much more expensive and less reliable than PSA such as the PSA described above. In some example, PSA is needed to attach these devices, in addition to their sealing method, so the present invention eliminates the need for these sealing operations via strategic use of the PSA. This results in a cost benefit

[0029] A second ingress is the seam between tamper tab 106 and the mounting panel on device 102, which by function must not be bonded to the mounting panel of the main body of device 102. Since tamper tab 106 must easily be separable from device 102, a seam is inevitable and the conventional alternative sealing methods above are much less applicable. The two primary situations where tamper seam ingress must be prevented are during shipping/storage or pre-installation and when device 102 is installed on surface 104. Prior to installation, the non-porous liner covers the gap and seam between tamper tab 106 and the mounting panel of device 102. Thus, during shipping and pre-installation storage, ingress is prevented. Once installed, the liner's function is replaced by surface 104, which again provides a non-porous boundary for the PSA and ingress is prevented

[0030] In another example, a security film may be used on the PSA substrate, and device 102 can be secured to a surface 104 that is transparent such as a window or windshield. Security film or tape can include single-side printed tape with very low tear strength applied over a service/access boundary during production. The printing of such tapes is typically proprietary, containing a hologram or other difficult-to-copy graphic indicator. The tape is broken when unwarranted access occurs and the break can be detected by visual inspection through a transparent surface. The mounting tape surface facing the transparent surface is visible to an observer, through the transparent surface itself. Use of a printed security film in the mounting adhesion layer facing the transparent surface allows for visible evidence of removal to be observed, even if device is reinstalled on the transparent surface. The advantages are numerous, including the cost benefits of combining PSA features with security (no separate-cost elements), and the fact that inspection for tampering may be done without removing device 102, or entering the vehicle in the case of transportation applications [0031] Turning to FIGURES 2A and 2B, FIGURES 2Aand 2B are a simplified exploded orthographic view illustrating an embodiment of device 102. During transportation and before device 102 is secured to surface 104, device 102 can include tamper tab 106, a main body 108, a mounting panel 110, mounting panel PSA 112, removable liner 114, and tamper tab PSA 116. Tamper tab PSA 116 may be the same PSA as mounting panel PSA 112 or may be a different PSA than mounting panel PSA 112. Tamper tab 106 can be lightly retained in a pocket of mounting panel 110 with a very low force retention method such as a slip fit, etc.

[0032] Turning to FIGURES 3, FIGURE 3 is a simplified orthographic view illustrating an embodiment of a portion of device 102. Device 102 can include tamper tab 106, main body 108, mounting panel 110, mounting panel PSA 112, and tamper tab PSA 120. Tamper tab PSA 120 may be the same PSA as tamper tab PSA 116 or may be a different PSA. Tamper tab 106 can be pushed against surface 104 by a compression mechanism 118. Compression mechanism 118 can provide an outward force on tamper tab 106, exerting force from the tab to the tamper contact pads on an internal circuit board (e.g., a printed circuit board).

[0033] Turning to FIGURES 4, FIGURE 4 is a simplified orthographic view illustrating an embodiment of a portion of device 102. Device 102 can include tamper tab 106, main body 108, mounting panel 110, mounting panel PSA 112, and tamper tab PSA 120. Tamper tab PSA 120 may be the same PSA as tamper tab PSA 116 or may be a different PSA. Tamper tab 106 can be held in place by a retention mechanism such as snaps, etc. If tamper tab 106 is fully retained in device 102, no compression force will translate thru the compression mechanism to surface 104 until tamper tab 106 is separated from device 106 by compression mechanism 118. Compression mechanism 118 can provide an outward force on tamper tab 106. In example, snaps or some type of securing means may be used to help hold tamper tab 118 in device and resist the outward force from compression mechanism 118.

[0034] Turning to FIGURE 5, FIGURE 5 is a simplified orthographic view illustrating an embodiment of a portion of serviceable chassis 100. As illustrated in FIGURE 5, tamper tab 106 can be coupled to or in contact with tamper tab PSA 120 and compression mechanism 118. Compression mechanism 118 may be a beryllium copper or plated brass formed spring contact. The positive compression of compression mechanism 118 can maintain continuity before, during, and after installation. [0035] Turning to FIGURE 6, FIGURE 6 is a simplified orthographic view illustrating an embodiment of device 100. Device 102 can be configured such that all seams of device 102 are within the boundary of the mounting surface (e.g. surface 104). The boundary between device 102 and surface 104 can be fully covered with mounting panel PSA 112 that includes a non-porous primary adhesion layer, a close-cell foam center layer (if applicable), a non- porous secondary adhesion layer, and a non-porous liner affixed to the secondary adhesion layer for storage and installation. The non-porous primary adhesion layer of the PSA conformally covers the main seam between the main case body and the mounting panel, providing a reliable ingress barrier.

[0036] Turning to FIGURE 7A, FIGURE 7A is a simplified orthographic view illustrating an embodiment of device 102 secured to transparent or translucent surface 122. Transparent or translucent surface 122 may be a window, windshield, frosted glass, or some other type of transparent of translucent material. Device 102 can be secured to transparent or translucent surface 122 using security film 124. Security film 124 can include single-side printed tape with very low tear strength applied over mounting panel PSA 112. The printing of such tapes is typically proprietary, containing a hologram or other difficult-to-copy graphic indicator.

[0037] Turning to FIGURE 7B, FIGURE 7B is a simplified orthographic view illustrating an embodiment of device 102 secured to transparent or translucent surface 122. As illustrated in FIGURE 7B, device 102 has been removed from transparent or translucent surface 122. As a result, security film 124 has been broken.

[0038] Turning to FIGURE 7C, FIGURE 7C is a simplified orthographic view illustrating an embodiment of device 102 secured to transparent or translucent surface 122. As illustrated in FIGURE 7C, device 102 has been put back after being removed as illustrated in FIGURE 7B. When unwarranted access occurs, such as the removal and replacement of device 102, the break can be detected by visual inspection of security film 124 through transparent or translucent surface 122. The design or security features of security film 124 facing transparent or translucent surface 122 are visible through transparent or translucent surface 122. Use of security film 124 in the mounting adhesion layer facing transparent or translucent surface 122 allows for visible evidence of removal to be observed, even if device is reinstalled on transparent or translucent surface 122. [0039] It is imperative to note that all of the specifications, dimensions, and relationships outlined herein (e.g., height, width, length, materials, etc.) have only been offered for purposes of example and teaching only. Each of these data may be varied considerably without departing from the spirit of the present disclosure, or the scope of the appended claims. The specifications apply only to one non-limiting example and, accordingly, they should be construed as such. In the foregoing description, example embodiments have been described. Various modifications and changes may be made to such embodiments without departing from the scope of the appended claims. The description and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.

[0040] Numerous other changes, substitutions, variations, alterations, and modifications may be ascertained to one skilled in the art and it is intended that the present disclosure encompass all such changes, substitutions, variations, alterations, and modifications as falling within the scope of the appended claims. In order to assist the United States Patent and Trademark Office (USPTO) and, additionally, any readers of any patent issued on this application in interpreting the claims appended hereto, Applicant wishes to note that the Applicant: (a) does not intend any of the appended claims to invoke paragraph six (6) of 35 U.S.C. section 112 as it exists on the date of the filing hereof unless the words "means for" or "step for" are specifically used in the particular claims; and (b) does not intend, by any statement in the specification, to limit this disclosure in any way that is not otherwise reflected in the appended claims.

OTHER NOTES AND EXAMPLES

[0041] Example Al is a device that includes a main body wherein the main body includes a mounting panel and a tamper tab located in the mounting panel, wherein the tamper tab is removably secured to the mounting panel, wherein the mounting panel and tamper tab are configured to secure the main body to a surface such that when the main body is removed from the surface, the tamper tab remains on the surface.

[0042] In Example A2, the subject matter of Example Al may optionally include where a pressure sensitive adhesive (PSA) helps secure the main body to the surface. [0043] In Example A3, the subject matter of any of the preceding 'A' Examples can optionally include where the PSA provides ingress protection for the main body to the surface.

[0044] In Example A4, the subject matter of any of the preceding 'A' Examples can optionally include where a tamper tab PSA is located on the tamper tab and the tamper tab PSA is different than the PSA.

[0045] In Example A5, the subject matter of any of the preceding 'A' Examples can optionally include security tape, wherein the security tape is located between the surface and the mounting panel.

[0046] In Example A6, the subject matter of any of the preceding 'A' Examples can optionally include where the surface is transparent and the security tapes is viewable through the surface.

[0047] Example AA1 is an electronic components, where the electronic components are housed in a main body. The main body includes a mounting panel, and a tamper tab located in the mounting panel. The tamper tab is removably secured to the mounting panel and the mounting panel and tamper tab are configured to secure the main body to a surface such that when the main body is removed from the surface, the tamper tab remains on the surface.

[0048] In Example AA2, the subject matter of Example AA1 may optionally include where a pressure sensitive adhesive (PSA) helps secure the main body to the surface.

[0049] In Example AA3, the subject matter of any of the preceding ΆΑ' Examples can optionally include where the PSA provides ingress protection for the main body to the surface.

[0050] In Example AA4, the subject matter of any of the preceding ΆΑ' Examples can optionally include where a tamper tab PSA is located on the tamper tab and the tamper tab PSA is different than the PSA.

[0051] In Example AA5, the subject matter of any of the preceding ΆΑ' Examples can optionally include security tape, wherein the security tape is located between the surface and the mounting panel.

[0052] In Example AA6, the subject matter of any of the preceding ΆΑ' Examples can optionally include where the surface is transparent and the security tape is viewable through the surface. [0053] Example Ml is a method that includes attaching a device to a surface inspecting the device to determine if the device has been tampered with, wherein one evidence of tampering is a missing tamper tab. The device includes a main body and the main body includes a mounting panel. The device also includes a tamper tab located in the mounting panel, where the tamper tab is removably secured to the mounting panel and the mounting panel and tamper tab are configured to secure the main body to a surface such that when the main body is removed from the surface, the tamper tab remains on the surface.

[0054] In Example M2, the subject matter of any of the preceding 'M' Examples can optionally include where a pressure sensitive adhesive (PSA) helps secure the main body to the surface.

[0055] In Example M3, the subject matter of any of the preceding 'M' Examples can optionally include where the PSA provides ingress protection for the main body to the surface.

[0056] In Example M4, the subject matter of any of the preceding 'M' Examples can optionally include where a tamper tab PSA is located on the tamper tab and the tamper tab PSA is different than the PSA.

[0057] In Example M5, the subject matter of any of the preceding 'M' Examples can optionally include where inspecting the device to determine if the device has been tampered with further includes inspecting security tape, where the security tape is located between the surface and the mounting panel and is visible through the surface.

[0058] An example system SI can include a main body that includes a mounting panel and a tamper tab located in the mounting panel. The tamper tab is removably secured to the mounting panel, wherein the mounting panel and tamper tab are configured to secure the main body to a surface such that when the main body is removed from the surface, the tamper tab remains on the surface.

[0059] An example system S2 can include where the first housing includes where a pressure sensitive adhesive (PSA) helps secure the main body to the surface.

[0060] In Example S3, the subject matter of any of the preceding 'SS' Examples can optionally include where the PSA provides ingress protection for the main body to the surface.