Title:
PHYSICAL QUANTITY MEASUREMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/145032
Kind Code:
A1
Abstract:
The invention solves the problem of poor compatibility between a printed circuit board surface resist and a silicone adhesive material that results in strong adhesive fixation not occurring. The objective of the present invention is to provide a structure that results in strong adhesive fixation between a printed circuit board and a silicone adhesive material. When fixing the printed circuit board to a support with a silicone adhesive material, the resist is removed from the printed circuit board to expose the base material (epoxy resin) of the printed circuit board, and the silicone adhesive material is brought into contact therewith.
Inventors:
ISHITSUKA NORIO (JP)
OGATA MASATOSHI (JP)
YOGO TAKAYUKI (JP)
OGATA MASATOSHI (JP)
YOGO TAKAYUKI (JP)
Application Number:
PCT/JP2019/048882
Publication Date:
July 16, 2020
Filing Date:
December 13, 2019
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
G01F1/684; G01F1/68; H05K3/28; H05K7/14
Foreign References:
| JP2008209243A | 2008-09-11 | |||
| JP2001257306A | 2001-09-21 | |||
| JP2006303122A | 2006-11-02 | |||
| JP2006310505A | 2006-11-09 |
Attorney, Agent or Firm:
TODA Yuji (JP)
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