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Patent Searching and Data


Title:
PHYSICAL QUANTITY SENSOR
Document Type and Number:
WIPO Patent Application WO/2014/192263
Kind Code:
A1
Abstract:
This physical quantity sensor is provided with a first substrate (10), a second substrate (40), a sensing unit (60), a pad unit (25) for the first substrate, and a pad unit (53) for the second substrate. The first substrate and the second substrate are bonded with each other such that one surface (10a) of the first and substrate and one surface (40a) of the second substrate face each other. The sensing unit is arranged in a hermetically sealed chamber (90) that is formed between the first and second substrates, and outputs a sensor signal that corresponds to a physical quantity. The pad unit for the first substrate is formed on the one surface of the first substrate and is electrically connected to the sensing unit. The pad unit for the second substrate is formed on the one surface of the second substrate and is bonded to the pad unit for the first substrate. The pad unit for the first substrate and the pad unit for the second substrate are configured using the same metal material, and are bonded with each other by metal joining.

Inventors:
SUGIMOTO KIYOMASA (JP)
SAKAI MINEKAZU (JP)
Application Number:
PCT/JP2014/002692
Publication Date:
December 04, 2014
Filing Date:
May 22, 2014
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
G01P15/08; G01P15/125; H01L29/84
Foreign References:
JP2013050320A2013-03-14
JP2010262961A2010-11-18
JP2010171368A2010-08-05
Attorney, Agent or Firm:
KIN, Junhi (JP)
Gold Junki (JP)
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