Title:
PICK AND BOND METHOD AND APPARATUS FOR TRANSFERRING ADHESIVE ELEMENT TO SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/138684
Kind Code:
A3
Abstract:
A method and apparatus for transferring formed adhesive elements from a reservoir (30) containing plural formed adhesive elements (12) to a bonding part attachable to a glass surface or other substrate through the use of adhesives. Transfer of the formed adhesive element to the bonding part (14) is accomplished by use of a vacuum tool (10) having a vacuum outlet, an internal plenum, and a series of vacuum lines formed in an adhesive element holding face. The vacuum tool is positioned over a reservoir of formed adhesive elements. Once the formed adhesive elements have been captured by the vacuum tool (10) the tool is used to place them into contact with the heated bonding part (14) directly or indirectly by intermediate placement onto a matrix (60) having a plurality of ejector pins (72) movably fitted therein. The ejector pins move the formed adhesive elements into position against the bonding part.
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Inventors:
HANSEL MATHIAS (DE)
Application Number:
PCT/IB2011/001423
Publication Date:
March 22, 2012
Filing Date:
May 03, 2011
Export Citation:
Assignee:
RAYMOND A & CIE (FR)
HANSEL MATHIAS (DE)
HANSEL MATHIAS (DE)
International Classes:
F16B11/00; C09J5/06; H01L23/498; H05K3/34
Foreign References:
| JP2007036082A | 2007-02-08 | |||
| US20060027624A1 | 2006-02-09 | |||
| JPH08288291A | 1996-11-01 | |||
| JPH08115916A | 1996-05-07 | |||
| JP2000332046A | 2000-11-30 | |||
| US5844316A | 1998-12-01 | |||
| US5761048A | 1998-06-02 | |||
| JP2010021445A | 2010-01-28 | |||
| US5751068A | 1998-05-12 |
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