Title:
PICK AND BOND METHOD FOR ATTACHMENT OF ADHESIVE ELEMENT TO SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2011/161514
Kind Code:
A3
Abstract:
A method for the attachment of a formed adhesive element (34,34') to a hot bonding part (10) in a practical and efficient way is disclosed. The formed adhesive element may be attached to the hot bonding part by the end-user prior to attachment of the hot bonding part to the substrate. In order to attach the formed adhesive element (34,34') to the bonding part according to the disclosed invention, the bonding part (10) is heated then is moved in position over the formed adhesive element positioned on a detent of a matrix plate (36). Thereafter the hot bonding part is moved into contact with the formed adhesive element or the formed adhesive element is moved against the hot bonding part. The bonding part, now having the formed adhesive element attached, is ready for attachment to the substrate. One or more formed adhesive elements may be attached to the bonding part. Attachment of the formed adhesive elements to the bonding part may be done manually or mechanically.
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Inventors:
HANSEL MATHIAS (DE)
LAURE FREDERIC (FR)
DAVERIO OLIVIER (FR)
LAURE FREDERIC (FR)
DAVERIO OLIVIER (FR)
Application Number:
PCT/IB2011/001384
Publication Date:
March 15, 2012
Filing Date:
May 03, 2011
Export Citation:
Assignee:
RAYMOND A & CIE (FR)
HANSEL MATHIAS (DE)
LAURE FREDERIC (FR)
DAVERIO OLIVIER (FR)
HANSEL MATHIAS (DE)
LAURE FREDERIC (FR)
DAVERIO OLIVIER (FR)
International Classes:
C09J5/06; F16B11/00; H01L23/498; H05K3/34
Foreign References:
| JPH09213742A | 1997-08-15 | |||
| US6426564B1 | 2002-07-30 | |||
| JPH1079404A | 1998-03-24 | |||
| US20020135066A1 | 2002-09-26 | |||
| US20060027624A1 | 2006-02-09 | |||
| DE4105949A1 | 1992-08-27 | |||
| US5531942A | 1996-07-02 | |||
| DE102006001885A1 | 2007-07-26 |
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