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Patent Searching and Data


Title:
PICK-UP DEVICE AND PICK-UP METHOD
Document Type and Number:
WIPO Patent Application WO/2018/139667
Kind Code:
A1
Abstract:
A pick-up device 10 for picking up a semiconductor chip 100 affixed to a front surface of a sheet material 110 is provided with: a stage 12 that includes a material a part or the entirety of which is capable of transmitting a destaticizing electromagnetic wave having an ionization effect and that vacuum-holds a rear surface of the sheet material 110; a thrust-up pin 26 for thrusting up the semiconductor chip 100 from the rear side of the stage 12: and a destaticizing mechanism 20 that eliminates charge generated between the semiconductor chip 100 and the sheet material 110 by irradiating the rear surface of the semiconductor chip 100 with the destaticizing electromagnetic wave that is made to pass through the sheet material 110 from the rear side of the stage 12.

Inventors:
MATSUNO YASUYUKI (JP)
NAKAMURA TOMONORI (JP)
TAKAYAMA SHIN (JP)
OMATA HIROSHI (JP)
Application Number:
PCT/JP2018/002908
Publication Date:
August 02, 2018
Filing Date:
January 30, 2018
Export Citation:
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Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60; H01L21/52; H01L21/683; H05F3/06
Foreign References:
JPH07235583A1995-09-05
JP2007115979A2007-05-10
JP2009064950A2009-03-26
JP2010199239A2010-09-09
Attorney, Agent or Firm:
YKI PATENT ATTORNEYS (JP)
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