Title:
PIEZOCOMPOSITE ULTRASOUND ARRAY AND INTEGRATED CIRCUIT ASSEMBLY
Document Type and Number:
WIPO Patent Application WO2003000337
Kind Code:
A3
Abstract:
An integrated piezoelectric ultrasound array (11) structure configured to minimize the effects of differential thermal expansion between the array (11) and the integrated circuit (32) and to improve the mechanical and acoustical integrity of the array. The transducer array (11) may have an interposed thinned supporting substrate (40) and is matched to the integrated circuit substrate for thermal expansion so as to retain mechanical integrity of the array/IC bond within the working temperature range. Transducer elements (10) are laterally isolated acoustically and as to thermal expansion by air or other acoustically attenuating medium of lower elastic modulus material between the elements (10). Acoustical effects are vertically acoustically isolated with capacitive coupling and small area solder bumps (34) relative to wavelength, and further laterally acoustically isolated by thin supporting substrates relative to wavelength, including thinned semiconductor integrated circuit substrates.
Inventors:
ERIKSON KENNETH R (US)
LEWIS GEORGE K (US)
WHITE TIMOTHY E (US)
LEWIS GEORGE K (US)
WHITE TIMOTHY E (US)
Application Number:
PCT/US2002/018876
Publication Date:
August 21, 2003
Filing Date:
June 13, 2002
Export Citation:
Assignee:
BAE SYSTEMS INFORMATION (US)
ERIKSON KENNETH R (US)
LEWIS GEORGE K (US)
WHITE TIMOTHY E (US)
ERIKSON KENNETH R (US)
LEWIS GEORGE K (US)
WHITE TIMOTHY E (US)
International Classes:
B06B1/06; G01S7/52; G01S7/521; G01S15/89; H01L27/20; A61B8/08; (IPC1-7): A61B8/00
Foreign References:
| US5957851A | 1999-09-28 | |||
| US5381067A | 1995-01-10 |
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