Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PIEZOELECTRIC COMPONENT AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2004/012330
Kind Code:
A1
Abstract:
A piezoelectric component capable of being downsized and enhanced in degree of freedom in positioning an external terminal, and a production method therefore. A surface acoustic wave device comprises an SAW element (6) having IDTs (2) formed on a piezoelectric substrate and conductive pads (3) connected with the IDTs (2), and a joint substrate (20) having conduction pad-use through holes (18), the joint substrate (20) being joined to the SAW element by an adhesive layer (21) so as to face IDTs (2). A protection space is formed by a hollow structure (16) for protecting the excitation part of surface acoustic wave such as IDTs (2). In addition, an external terminal (22) connected with the conductive pads (3) via the through holes (18) is positioned deviated from the through holes (18).

Inventors:
KOSHIDO YOSHIHIRO (JP)
Application Number:
PCT/JP2003/009311
Publication Date:
February 05, 2004
Filing Date:
July 23, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA MANUFACTURING CO (JP)
KOSHIDO YOSHIHIRO (JP)
International Classes:
H01L41/187; H01L41/22; H01L41/23; H01L41/29; H01L41/09; H01L41/313; H03H3/08; H03H9/05; H03H9/25; H03H9/56; H03H9/64; (IPC1-7): H03H9/02; H03H9/17; H03H9/25; H03H3/08
Foreign References:
JPH08213874A1996-08-20
JPH09326663A1997-12-16
JPH11355088A1999-12-24
JPH1032293A1998-02-03
JP2001185976A2001-07-06
Other References:
See also references of EP 1458094A4
Download PDF: