Title:
PIEZOELECTRIC DEVICE AND METHOD OF MANUFACTURE THEREOF
Document Type and Number:
WIPO Patent Application WO/2000/033455
Kind Code:
A1
Abstract:
A base (1), on which input/output electrode patterns (3) are formed, has an opening in the center. On the other hand, an integrated circuit (2) has an active surface, on which a number of bumps (4) are formed toward its two opposite sides, and the integrated circuit (2) is placed over the center of the opening. The integrated circuit (2) is connected with the electrode patterns (3) on the base (1) through the bumps (4) by ultrasonic bonding. This method improves the connection between the integrated circuit and the base that are joined by flip-chip bonding, and provides a low-cost, small-sized, reliable thin piezoelectric device capable of resisting mechanical and thermal shocks.
Inventors:
KIKUSHIMA MASAYUKI (JP)
Application Number:
PCT/JP1999/006091
Publication Date:
June 08, 2000
Filing Date:
November 01, 1999
Export Citation:
Assignee:
SEIKO EPSON CORP (JP)
KIKUSHIMA MASAYUKI (JP)
KIKUSHIMA MASAYUKI (JP)
International Classes:
H03H3/02; H03H9/05; H03H9/10; (IPC1-7): H03B5/32; H03H9/10; H03H3/02
Foreign References:
| JPH07297666A | 1995-11-10 | |||
| JPH11186850A | 1999-07-09 | |||
| JPH11308052A | 1999-11-05 | |||
| JPH11354587A | 1999-12-24 | |||
| JPH10284972A | 1998-10-23 | |||
| JPH09148381A | 1997-06-06 | |||
| JPH08264540A | 1996-10-11 | |||
| JPH0418732A | 1992-01-22 | |||
| JPH08222606A | 1996-08-30 |
Other References:
H. YATSUDA et al., "Miniaturized SAW Filters Using a Flip-Chip Technique", IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, Vol. 43, No. 1, (January 1996), pages 125-129.
Attorney, Agent or Firm:
Suzuki, Kisaburo (Owa 3-Chome Suwa-Shi, Nagano, JP)
Download PDF:
Previous Patent: DC/DC CONVERTER WITH MULTIPLE INPUTS
Next Patent: OSCILLATOR AND TELECOMMUNICATIONS SYSTEM WITH SUCH AN OSCILLATOR
Next Patent: OSCILLATOR AND TELECOMMUNICATIONS SYSTEM WITH SUCH AN OSCILLATOR