Title:
PIEZOELECTRIC OSCILLATION DEVICE, METHOD FOR MANUFACTURING A PIEZOELECTRIC OSCILLATION DEVICE, AND ETCHING METHOD OF STRUCTURAL COMPONENTS FORMING A PIEZOELECTRIC OSCILLATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/074127
Kind Code:
A1
Abstract:
A piezoelectric oscillation device is provided with a piezoelectric oscillating plate forming an excitation electrode, and an upper cover and a lower cover for hermetically sealing the excitation electrode, and has a bonding region for each of the upper cover and the lower cover on the front and back main surfaces of the piezoelectric oscillating plate, a region for bonding the piezoelectric oscillating plate to a primary surface of the upper cover, and a region for bonding the piezoelectric oscillating plate to a primary surface of the lower cover. Bonding material is formed in each of the bonding region of the piezoelectric oscillating plate, the bonding region of the upper cover, and the bonding region of the lower cover. The bonding region of the piezoelectric oscillating plate and the bonding region of the upper cover are bonded by the bonding material. The bonding region of the piezoelectric oscillating plate and the bonding region of the lower cover are bonded by the bonding material. In addition, at least one of the base of the bonding region of the piezoelectric oscillating plate, the base of the bonding region of the upper cover, and the base of the bonding region of the lower cover is roughened.
Inventors:
KOHDA NAOKI (JP)
YOSHIOKA HIROKI (JP)
YOSHIOKA HIROKI (JP)
Application Number:
PCT/JP2009/071401
Publication Date:
July 01, 2010
Filing Date:
December 24, 2009
Export Citation:
Assignee:
DAISHINKU CORP (JP)
KOHDA NAOKI (JP)
YOSHIOKA HIROKI (JP)
KOHDA NAOKI (JP)
YOSHIOKA HIROKI (JP)
International Classes:
H01L23/02; H03H9/02; H03H3/02
Foreign References:
| JP2005295299A | 2005-10-20 | |||
| JP2002171150A | 2002-06-14 | |||
| JPH1051265A | 1998-02-20 | |||
| JP2004153100A | 2004-05-27 | |||
| JP2005197530A | 2005-07-21 | |||
| JP2008282912A | 2008-11-20 | |||
| JPH06303080A | 1994-10-28 | |||
| JPH06310971A | 1994-11-04 | |||
| JP3319221B2 | 2002-08-26 |
Other References:
See also references of EP 2381575A4
Attorney, Agent or Firm:
ARC PATENT ATTORNEYS' OFFICE (JP)
Patent business corporation ARC PATENT ATTORNEYS' OFFICE (JP)
Patent business corporation ARC PATENT ATTORNEYS' OFFICE (JP)
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