Title:
PIEZOELECTRIC OSCILLATOR AND PIEZOELECTRIC OSCILLATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/145483
Kind Code:
A1
Abstract:
In the present invention, a bonding pad for wire bonding is formed on the outer surface of a first sealing plate of a piezoelectric oscillator having the first sealing plate and a second sealing plate, which are joined to the two main surfaces of a piezoelectric oscillation plate. Non-joining regions that are not joined to each other are provided to part of the outer peripheral portion of one sealing plate among the first and second sealing plates and to part of the outer peripheral portion of the piezoelectric oscillation plate. The bonding pad overlaps the non-joining region in plan view.
Inventors:
YAMASHITA HIROAKI (JP)
OKAMAE HIROKI (JP)
HARADA KOKI (JP)
OKAMAE HIROKI (JP)
HARADA KOKI (JP)
Application Number:
PCT/JP2023/000753
Publication Date:
August 03, 2023
Filing Date:
January 13, 2023
Export Citation:
Assignee:
DAISHINKU CORP (JP)
International Classes:
H03H9/19; H03B5/32; H03H9/02
Foreign References:
| JP2012249179A | 2012-12-13 | |||
| JP2012124706A | 2012-06-28 | |||
| JP2020108109A | 2020-07-09 | |||
| JP2021158586A | 2021-10-07 |
Attorney, Agent or Firm:
OKADA Kazuhide (JP)
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