PIEZOELECTRIC-SENSOR PRODUCTION METHOD

WIPO Patent Application WO/2015/098724

A1

A sheet-like flexible printed substrate (3) having a copper foil (50) affixed to the entirety of one main surface thereof is prepared (S1). Conductor patterns are formed (S2) on the one main surface of the flexible printed substrate (3). The flexible printed substrate (3) is stamped with a press die, and a flexible printed substrate (30) is formed (S3). An adhesive agent is used to affix (S4) a piezoelectric film (31) to the top of a first detection electrode (34) of a substrate section (36). The substrate section (36) in a state of having had the piezoelectric film (31) affixed to the top of the first detection electrode (34) thereof is pressed (S5). A substrate section (37) is folded back, the adhesive agent is used to affix a second detection electrode (35) to the piezoelectric film (31), and the piezoelectric film (31) is sandwiched (S6) between the first detection electrode (34) and the second detection electrode (35). A sensor unit (16) in a state in which the piezoelectric film (31) is being sandwiched is pressed (S7).

JPS63228037	FORCE MEASURING DEVICE
JP3123799	PRESSURE SENSOR
WO/2016/089310	ACOUSTIC TRANSDUCERS FOR STRUCTURAL HEALTH MONITORING AND METHODS OF FABRICATION

KAWAMURA HIDEKI (JP)
NAKAJI HIROYUKI (JP)
YAMAGUCHI YOSHIHIRO (JP)
ENDO JUN (JP)
SAITO MASATO (JP)

PCT/JP2014/083654

July 02, 2015

December 19, 2014

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MURATA MANUFACTURING CO (JP)

G01L1/16; G06F3/041; H01L41/047; H01L41/053; H01L41/113; H01L41/193

WO2011138903A1

2011-11-10

JP2009080090A	2009-04-16
JP2009053109A	2009-03-12
JPH0267207U	1990-05-22

Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)

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