PIEZOELECTRIC SUBSTRATE ATTACHMENT STRUCTURE, SENSOR MODULE, MOVING BODY, AND PROTECTING BODY

Title:

PIEZOELECTRIC SUBSTRATE ATTACHMENT STRUCTURE, SENSOR MODULE, MOVING BODY, AND PROTECTING BODY

Document Type and Number:

WIPO Patent Application WO/2018/062057

Kind Code:

A1

Abstract:

This piezoelectric substrate attachment structure comprises: a pressing portion which is pressed by being contacted; a piezoelectric substrate provided adjacent to the pressing portion; and a base portion provided adjacent to the piezoelectric substrate, on the opposite side to the pressing portion. The following relational expression (a) is satisfied, where da is the thickness of the pressing portion in the direction in which the piezoelectric substrate is adjacent thereto, E'a is a storage elastic modulus of the pressing portion, as obtained by dynamic viscoelasticity measurement, db is the thickness of the base portion in said adjacent direction, and E'b is the storage elastic modulus of the base portion, obtained by dynamic viscoelasticity measurement. da/E'a < db/E'b ... Formula (a)

Inventors:

TANIMOTO KAZUHIRO (JP)
MITSUZAKA MASAHIKO (JP)
YOSHIDA MITSUNOBU (JP)

Application Number:

PCT/JP2017/034393

Publication Date:

April 05, 2018

Filing Date:

September 22, 2017

Export Citation:

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Assignee:

MITSUI CHEMICALS INC (JP)

International Classes:

G01L1/16; H01L41/053; H01L41/087; H01L41/113; H01L41/193

Foreign References:

JPH02181621A	1990-07-16
JP2005153675A	2005-06-16
JPS645184U	1989-01-12
JP2014173950A	2014-09-22
US6169479B1	2001-01-02

Other References: