PIN, PIN COMBINATION STRUCTURE, PACKAGING BODY AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2020/103406

A1

The present application provides a pin, a pin combination structure, a packaging body and a manufacturing method therefor. A cover plate or skirt structure is sleeved on the pin so as to prevent a molding material from overflowing from a cavity accommodating the molding material in a mold for packaging the packaging body when the molding material is filled. The pin is applied to the packaging body, and the packaging body comprises the pin, a substrate, and the molding material; the pin comprises a pin body and a baffle structure; the bottom of the body is welded to the substrate, the baffle structure is sleeved on the middle of the body; the molding material covers the substrate and wraps a portion from the bottom to the middle of the body; the baffle structure is configured to block overflow of the molding material from the cavity when the molding material is filled into the cavity; the cavity is a cavity accommodating the molding material in the mold for packaging the packaging body, and the cavity accommodates the portion from the bottom to the middle of the body as well as the substrate; the substrate is located at the bottom of the cavity; the middle of the body is located at the top of the cavity; the side wall of the top of the cavity abuts against the baffle structure of the body.

WU HONG (CN)
LV ZHEN (CN)

PCT/CN2019/086735

May 28, 2020

May 14, 2019

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HUAWEI TECH CO LTD (CN)

H01L23/498

CN109727947A	2019-05-07
CN107086183A	2017-08-22
US20160240452A1	2016-08-18
CN105074919A	2015-11-18
CN106910692A	2017-06-30
CN201811376365A	2018-11-19

See also references of EP 3783645A4

SHENPAT INTELLECTUAL PROPERTY AGENCY (CN)

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