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Patent Searching and Data


Title:
PIPE BENDING METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2005/063419
Kind Code:
A1
Abstract:
A device for processing a piping assembly constituted of a pipe with a joint. The device has a first die having a first guide with a shape based on which a pipe is bent, first holding means for holding a joint, the joint being held on one side of the first guide, second holding means for holding the pipe, the pipe being held on the other side of the first guide, and drive means for moving the first die and the first holding means relative to the second holding means to bend the pipe. Since the first holding means holds the joint instead of the pipe when the pipe is bent, a straight pipe length required to directly hold the pipe can be eliminated, and also deformation and damage to the pipe can be prevented.

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Inventors:
MUTAI MASAO (JP)
YAMADA SYOZO (JP)
Application Number:
PCT/JP2004/019325
Publication Date:
July 14, 2005
Filing Date:
December 24, 2004
Export Citation:
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Assignee:
GAC CORP (JP)
MUTAI MASAO (JP)
YAMADA SYOZO (JP)
International Classes:
B21D7/024; (IPC1-7): B21D7/025
Foreign References:
JPH0417923A1992-01-22
JPS4932540U1974-03-22
JPH09155456A1997-06-17
Attorney, Agent or Firm:
Imai, Akira (4-20 Chuo 1-chom, Matsumoto-shi Nagano 11, JP)
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