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Title:
PIPE JOINT, FLUID CONTROL EQUIPMENT, FLUID CONTROL DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE, AND PIPE JOINT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/038274
Kind Code:
A1
Abstract:
Provided is a pipe joint comprising: a first member 2; a second member 10; a weld part 8 that joins a first outer peripheral end 14a and a second outer peripheral end 10b while maintaining contact between the first outer peripheral end 14a and the second outer peripheral end 10b over the entire circumferences thereof and causing lateral contraction; an annular seal part 42 that is formed by a first pressing part 22 and a second pressing part 28 moving in directions approaching each other due to the lateral contraction; a heat transmission suppression member 16 that is disposed in a space 26 between the weld part and the seal part 42 in the first and second members 2 and 10, and that suppresses the transmission of welding heat from the weld part 8 to the seal part 42; and a first retaining ring 36 that is fitted onto an outer peripheral surface 16a of the heat transmission suppression member 16 and that retains the heat transmission suppression member 16 in the inner surface of the first member 2 or the second member 10.

Inventors:
WATANABE KAZUNARI (JP)
INADA TOSHIYUKI (JP)
SHINOHARA TSUTOMU (JP)
NAKATA TOMOHIRO (JP)
Application Number:
PCT/JP2016/070883
Publication Date:
March 09, 2017
Filing Date:
July 14, 2016
Export Citation:
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Assignee:
FUJIKIN KK (JP)
International Classes:
F16L13/02; B23K9/028; F16L55/00; H01L21/3065; B23K9/035; F16L55/11
Domestic Patent References:
WO2007017937A12007-02-15
Foreign References:
JPH07174232A1995-07-11
JP2004074086A2004-03-11
Attorney, Agent or Firm:
NAGATO, Kanji (JP)
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