Title:
PLACING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/130519
Kind Code:
A1
Abstract:
This placing device is provided with: a placing unit that places a member on a substrate; a moving device that moves the placing unit with respect to the substrate; and a control device that controls operations of the moving device and the placing unit. In the cases of aligning the placing unit by moving the placing unit toward the substrate, the control device moves the placing unit at a first deceleration rate by means of the moving device, then, aligns the placing unit by moving the placing unit at a second deceleration rate that is higher than the first deceleration rate, and in the cases of separating the placing unit after placing the member on the substrate, the control device moves the placing unit at a first acceleration rate by means of the moving device, then, moves, by means of the moving device, the placing unit at a second acceleration rate that is higher than the first acceleration rate. The second deceleration rate and the first acceleration rate can be separately set.
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Inventors:
OHASHI TERUYUKI (JP)
Application Number:
PCT/JP2017/047098
Publication Date:
July 04, 2019
Filing Date:
December 27, 2017
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/04
Domestic Patent References:
| WO2015122449A1 | 2015-08-20 |
Foreign References:
| JP2016081941A | 2016-05-16 | |||
| JP2006261367A | 2006-09-28 | |||
| JP2016172315A | 2016-09-29 |
Attorney, Agent or Firm:
KAI-U PATENT LAW FIRM (JP)
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