Title:
PLANAR LIGHTWAVE CIRCUIT-BASED INTEGRATED OPTICAL CHIP
Document Type and Number:
WIPO Patent Application WO/2017/018596
Kind Code:
A1
Abstract:
In an embodiment, an integrated optical chip comprises: a substrate; a plurality of planar lightwave circuit-based optical components that are formed on one surface of the substrate; and a plurality of optical waveguides that are formed on the one surface of the substrate and that connect the plurality of optical components to one another. In the embodiment, the plurality of optical components include a saturable absorber having nonlinear loss characteristics. The saturable absorber may comprise: a core layer that is formed on the one surface of the substrate; an overcladding layer that wraps around at least a part of the core layer; and a saturable absorption layer that is formed on at least a part of the overcladding layer and that is arranged so as to interact with an evanescent field of light guided through at least a part of the core layer.
Inventors:
KIM JUNG WON (KR)
KIM CHUR (KR)
KIM CHUR (KR)
Application Number:
PCT/KR2015/010527
Publication Date:
February 02, 2017
Filing Date:
October 06, 2015
Export Citation:
Assignee:
KOREA ADVANCED INST SCI & TECH (KR)
International Classes:
G02B6/12; H01S3/11
Foreign References:
| KR101059310B1 | 2011-08-24 | |||
| KR20080101862A | 2008-11-21 | |||
| KR100317575B1 | 2001-12-24 | |||
| KR20040050423A | 2004-06-16 | |||
| KR20070085077A | 2007-08-27 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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