Title:
PLANARIZING METHOD AND PLANARIZING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/108284
Kind Code:
A1
Abstract:
[Purpose] To make a device compact while realizing precise planarizing, and to prevent the risk of breakage in a workpiece during working. [Solution] The prevent invention is provided with a holder (8), a driving motor (101), a supporting substrate (4), a reciprocal driving mechanism (5), and a driving cylinder (102). The holder (8) holds the rear surface of a substrate workpiece (7). The driving motor (101) rotates the substrate workpiece (7) around an axis that intersects the front surface of the substrate workpiece (7) within the front surface. The supporting substrate (4) holds a pad (6) and positions the front surface thereof to face the front surface of the substrate workpiece (7). The reciprocal driving mechanism (5) reciprocally moves the supporting substrate (4) in a direction parallel to the front surface of the pad (6) to at least an extent that flattening by a catalytic reaction becomes possible. The driving cylinder (102) advances the holder (8) in a direction intersecting the front surface of the pad (6) so as to bring the front surface of the substrate workpiece (7) and the front surface of the pad (6) into contact against each other or close to each other.
More Like This:
Inventors:
SUZUKI EISUKE (JP)
YAMAUCHI KAZUTO (JP)
SUZUKI TATSUTOSHI (JP)
SUZUKI DAISUKE (JP)
YAMAUCHI KAZUTO (JP)
SUZUKI TATSUTOSHI (JP)
SUZUKI DAISUKE (JP)
Application Number:
PCT/JP2015/086493
Publication Date:
July 07, 2016
Filing Date:
December 28, 2015
Export Citation:
Assignee:
TOHO ENGINEERING CO LTD (JP)
UNIV OSAKA (JP)
UNIV OSAKA (JP)
International Classes:
B24B1/00; B01J37/02; H01L21/306
Foreign References:
| JP2014038981A | 2014-02-27 | |||
| JP2009184088A | 2009-08-20 |
Attorney, Agent or Firm:
MORITA KENICHI (JP)
Ken-ichi Morita (JP)
Ken-ichi Morita (JP)
Download PDF: