PLASMA CVD FILM-FORMING APPARATUS

WIPO Patent Application WO/2005/035826

A1

An apparatus for forming a CVD film on at least one of the inner surface and outer surface of a plastic container is disclosed wherein the plasma intensity is increased. The CVD film-forming apparatus is characterized in that a secondary electron emission layer is formed on the entire or a part of the wall of a space provided in an external electrode for housing a plastic container and the secondary electron emission layer is composed of a material having a secondary electron emission coefficient larger than that of the electrode material for the external electrode. It is further characterized in that a secondary electron emission layer is formed on the entire or a part of the surface of an internal electrode which is removably arranged within the container to be insulated with the external electrode and the secondary electron emission layer is composed of a material having a secondary electron emission coefficient larger than that of the electrode material for the internal electrode.

TAKEMOTO KEISHU (JP)
KAGE TSUYOSHI (JP)
KOBAYASHI TAKUMI (SG)

PCT/JP2004/013914

April 21, 2005

September 24, 2004

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MITSUBISHI SHOJI PLASTICS CORP (JP)
YOUTEC CO LTD (JP)
TAKEMOTO KEISHU (JP)
KAGE TSUYOSHI (JP)
KOBAYASHI TAKUMI (SG)

B65D23/02; B65D1/02; B65D23/08; B65D25/34; C23C16/04; C23C16/509; (IPC1-7): C23C16/505; B65D1/00

WO2003085165A1

2003-10-16

JP2001335947A	2001-12-07
JP2002371364A	2002-12-26
JP2001213419A	2001-08-07
JPH10335098A	1998-12-18
JP2000282243A	2000-10-10

Imashita, Katsuhiro (Setoguchi Bldg. 3rd FL. 12-5, Nishi-shimbashi 2-chom, Minato-ku Tokyo, JP)

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