Title:
PLASMA ETCHING APPARATUS AND PLASMA ETCHING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/016525
Kind Code:
A1
Abstract:
Disclosed is a plasma etching apparatus which is provided with: a processing container which can maintain an atmosphere under lower pressure than atmospheric pressure; a depressurizing section which depressurizes the inside of the processing container to be under predetermined pressure; a placing section, which is provided inside of the processing container and has placed thereon a subject to be processed; an electric discharge tube, which has, inside thereof, a region where plasma is to be generated, and which is provided at a position separated from the processing container; an introducing waveguide, which propagates microwaves radiated from a microwave generating section and introduces the microwaves into the region where plasma is to be generated; a gas supply section which supplies a process gas to the region where plasma is to be generated; a transporting tube which connects the electric discharge tube and the processing container; a detection window which is provided on the wall surface of the processing container and passes through light; an interfering light detecting section which has a plurality of light receiving elements on a light receiving surface which receives interfering light emitted from the surface of the subject placed on the placing section; and a control unit which detects an etching end point, on the basis of output of the interfering light detecting section. The control unit extracts output of the light receiving elements in a portion equivalent to an etching portion from output of the light receiving elements in the detection region of the interfering light detecting section, and detects the etching end point, on the basis of the interfering light intensity obtained from the output of the light receiving elements in the portion equivalent to the etching portion.
Inventors:
MATSUSHIMA DAISUKE (JP)
Application Number:
PCT/JP2010/063306
Publication Date:
February 10, 2011
Filing Date:
August 05, 2010
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP (JP)
MATSUSHIMA DAISUKE (JP)
MATSUSHIMA DAISUKE (JP)
International Classes:
H01L21/3065
Foreign References:
| JP2002270588A | 2002-09-20 | |||
| JP2006528428A | 2006-12-14 | |||
| JP2001249050A | 2001-09-14 | |||
| JP2005302771A | 2005-10-27 |
Attorney, Agent or Firm:
HYUGAJI, Masahiko et al. (JP)
Masahiko Hiugaji (JP)
Masahiko Hiugaji (JP)
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