PLASMA GENERATION DEVICE

WIPO Patent Application WO/2011/033849

A1

Disclosed is a plasma generation device which irradiates an object to be processed with plasma that is generated at a gas pressure of not less than 100 Pa but not more than the atmospheric pressure in the space between a first electrode to which the power supply is connected and a second electrode which is arranged so as to face the first electrode and grounded. The first electrode is configured so as to be held by a grounded conductive holding member with a solid dielectric body interposed therebetween, and the solid dielectric body is provided on a surface of the first electrode, said surface not facing the second electrode. Among the surface of the solid dielectric body, a predetermined region that is in contact with the conductive holding member and another predetermined region that is not in contact with the conductive holding member are provided with a continuous conductive film.

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IZUO SHINICHI (JP)
YOSHIDA YUKIHISA (JP)
MURAKAMI TAKAAKI (JP)

PCT/JP2010/061979

March 24, 2011

July 15, 2010

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MITSUBISHI ELECTRIC CORP (JP)
IZUO SHINICHI (JP)
YOSHIDA YUKIHISA (JP)
MURAKAMI TAKAAKI (JP)

H05H1/24; C23C16/50

WO2006103945A1	2006-10-05
WO2009125568A1	2009-10-15

JP2005019508A	2005-01-20
JP2008182012A	2008-08-07
JP2005019150A	2005-01-20
JP2001519584A	2001-10-23
JP2004064946A	2004-02-26
JP2004259506A	2004-09-16
JP2005332784A	2005-12-02

SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)

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