Title:
PLASMA PROCESSING APPARATUS AND METHOD FOR CONTROLLING PLASMA PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/074322
Kind Code:
A1
Abstract:
A plasma processing apparatus of the present embodiment is provided with: a grounded processing container; a placement stand that supports an object to be processed inside the processing container; a plurality of electrodes disposed so as to face opposite the placement stand of the processing container, said plurality of electrodes being mutually insulated; a high frequency power supply that supplies high frequency power for plasma generation, said high frequency power supply being electrically connected between two different electrodes among the plurality of electrodes, or between one electrode among the plurality of electrodes and the processing container; and an impedance variable circuit that can control impedance, said impedance variable circuit being electrically connected between two different electrodes among the plurality of electrodes, or between one electrode among the plurality of electrodes and the processing container.
Inventors:
HIRAYAMA MASAKI (JP)
Application Number:
PCT/JP2017/037016
Publication Date:
April 26, 2018
Filing Date:
October 12, 2017
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
UNIV TOHOKU (JP)
UNIV TOHOKU (JP)
International Classes:
H05H1/46; H01L21/3065; H01L21/31
Domestic Patent References:
| WO2015190326A1 | 2015-12-17 |
Foreign References:
| JP2015026475A | 2015-02-05 | |||
| JP2012124184A | 2012-06-28 | |||
| JPH10289881A | 1998-10-27 | |||
| JP2012022917A | 2012-02-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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