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Patent Searching and Data


Title:
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/002232
Kind Code:
A1
Abstract:
Disclosed is a plasma processing method wherein a common gas supplied from a common gas source (41) is split into two systems by a flow splitter (44), and the common gas split into the two systems is introduced into a center introducing port (58 (55)), which is provided at the center of the dielectric window (16) of a processing container (2), and into a plurality of peripheral introducing ports (62), which are disposed in the circumferential direction above a substrate (W). An additive gas is added to the split common gas in one of the two systems. The common gas and the additive gas introduced into the processing container (2) are released from an air-releasing port (11a) below a substrate (W), and the inside of the processing container (2) is depressurized. Microwaves are introduced into the processing container (2) using a slot antenna (20) having a plurality of slots (21), and the electron temperature of the region where the peripheral introducing ports (62) are provided is set lower than that of the region where the center introducing port (58 (55)) is provided.

Inventors:
MATSUMOTO NAOKI (JP)
YOSHIKAWA WATARU (JP)
SEO YASUHIRO (JP)
KATO KAZUYUKI (JP)
Application Number:
PCT/JP2011/064311
Publication Date:
January 05, 2012
Filing Date:
June 22, 2011
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
MATSUMOTO NAOKI (JP)
YOSHIKAWA WATARU (JP)
SEO YASUHIRO (JP)
KATO KAZUYUKI (JP)
International Classes:
H01L21/3065; H05H1/46
Foreign References:
JP2010118549A2010-05-27
JP2007250838A2007-09-27
JP2007184329A2007-07-19
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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Claims: