Title:
PLASMA PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/004997
Kind Code:
A1
Abstract:
A plasma processing apparatus for processing a substrate by use of plasma. The plasma processing apparatus comprises a processing container; a mounting stage which is located in the processing container and on which a substrate is mounted; a gas shower head comprising a conductive member which is opposed to the mounting stage and the lower surface of which has a multiplicity of gas discharging apertures for supplying a processing gas into the processing container; an induction coil to which a high frequency current is supplied so as to generate an inductive coupling plasma in a region surrounding a space below the gas shower head; a negative voltage supplying means for applying a negative DC voltage to the gas shower head so as to lead an electrical field, which is inducted by the induction coil, to a central portion of the processing region; and a means for evacuating the processing container.
Inventors:
SAWADA IKUO (JP)
KANG SONGYUN (JP)
KASAI SHIGERU (JP)
KANG SONGYUN (JP)
KASAI SHIGERU (JP)
Application Number:
PCT/JP2009/062378
Publication Date:
January 14, 2010
Filing Date:
July 07, 2009
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
SAWADA IKUO (JP)
KANG SONGYUN (JP)
KASAI SHIGERU (JP)
SAWADA IKUO (JP)
KANG SONGYUN (JP)
KASAI SHIGERU (JP)
International Classes:
H01L21/3065; H05H1/46
Foreign References:
| JPH06291064A | 1994-10-18 | |||
| JP2000012293A | 2000-01-14 | |||
| JP2004095663A | 2004-03-25 | |||
| JP2008192906A | 2008-08-21 | |||
| JP2008198659A | 2008-08-28 |
Attorney, Agent or Firm:
YOSHITAKE Kenji et al. (JP)
Kenji Yoshitake (JP)
Kenji Yoshitake (JP)
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