Title:
PLASMA PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/114793
Kind Code:
A1
Abstract:
Disclosed is a plasma processing apparatus which performs plasma processing under substantially atmospheric pressure to a non-planar subject to be processed. In the plasma processing apparatus, a pair of conductive wires are disposed at an interval of 1 mm or less on a dielectric board that conforms with the shape of the subject, the conductive wires are covered with a dielectric thin film having a thickness of 1 mm or less by, for instance, thermally spraying a dielectric material over the conductive wires, and plasma is generated along the shape of the subject by applying high-frequency power to the pair of conductive wires.
Inventors:
KOBAYASHI HIROYUKI (JP)
MAEDA KENJI (JP)
TANDOU TAKUMI (JP)
NAKASHIMA SHOICHI (JP)
OHNO SHIGERU (JP)
MAEDA KENJI (JP)
TANDOU TAKUMI (JP)
NAKASHIMA SHOICHI (JP)
OHNO SHIGERU (JP)
Application Number:
PCT/JP2011/052344
Publication Date:
September 22, 2011
Filing Date:
February 04, 2011
Export Citation:
Assignee:
HITACHI LTD (JP)
KOBAYASHI HIROYUKI (JP)
MAEDA KENJI (JP)
TANDOU TAKUMI (JP)
NAKASHIMA SHOICHI (JP)
OHNO SHIGERU (JP)
KOBAYASHI HIROYUKI (JP)
MAEDA KENJI (JP)
TANDOU TAKUMI (JP)
NAKASHIMA SHOICHI (JP)
OHNO SHIGERU (JP)
International Classes:
B01J19/00; B08B7/00; C23C16/505; H01L21/205; H01L21/304; H01L21/3065; H05H1/24
Foreign References:
| JP2008288437A | 2008-11-27 | |||
| JPH07130491A | 1995-05-19 | |||
| JPH10158846A | 1998-06-16 | |||
| JP2009123505A | 2009-06-04 |
Attorney, Agent or Firm:
TSUTSUI, YAMATO (JP)
Tsutsui Daiwa (JP)
Tsutsui Daiwa (JP)
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Claims: