PLASMA PROCESSING DEVICE AND DETERIORATION DETERMINATION METHOD

Title:

PLASMA PROCESSING DEVICE AND DETERIORATION DETERMINATION METHOD

Document Type and Number:

WIPO Patent Application WO/2024/023898

Kind Code:

A1

Abstract:

This plasma processing device (100) processes a workpiece with a plasma, the plasma processing device (100) comprising: a table (102) on which a focus ring (103) to be inspected is placed; a driving unit that drives the table (102); a driving data acquiring unit that acquires driving data about the table (102) driven by the driving unit; and a determining unit (113) that uses the driving data acquired by the driving data acquiring unit to derive a physical parameter that depends on the mass of the focus ring (103) to be inspected, and determines whether the focus ring (103) to be inspected has deteriorated.

Inventors:

HAYASHI HIDEMATSU (JP)
KUMEKAWA SHIZUO (JP)
FUJIHARA MITSUTERU (JP)
TSUNODA KEISUKE (JP)

Application Number:

PCT/JP2022/028661

Publication Date:

February 01, 2024

Filing Date:

July 25, 2022

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)

International Classes:

H01L21/3065

Foreign References:

JP2017092435A	2017-05-25
JP2016100407A	2016-05-30
US20210118685A1	2021-04-22

Attorney, Agent or Firm:

KIMURA Mitsuru (JP)

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