Title:
PLASMA PROCESSING DEVICE AND OPENING/CLOSING MECHANISM USED THEREIN
Document Type and Number:
WIPO Patent Application WO/2015/151149
Kind Code:
A1
Abstract:
This plasma etching device (1) is provided with a processing chamber (2), an evacuation mechanism (30), and the like. The processing chamber (2) contains a plasma generation unit (3), a processing unit (4), an evacuation unit (5), and a manifold unit (6). The evacuation mechanism (30), which evacuates gases from the processing chamber (2), comprises the following: a vacuum pump (31) that has an inlet that is connected to an opening (8); a valve member (32) inserted into another opening (9); and a movement mechanism (34) that moves said valve member (32) vertically. The former opening (8), which is formed in a third chamber (2c) that constitutes part of the processing chamber (2), is connected to the inlet of the vacuum pump (31) without any piping or the like interposed therebetween.
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Inventors:
HAYAMI TOSHIHIRO (JP)
Application Number:
PCT/JP2014/059431
Publication Date:
October 08, 2015
Filing Date:
March 31, 2014
Export Citation:
Assignee:
SPP TECHNOLOGIES CO LTD (JP)
International Classes:
H01L21/3065; B01J3/02; H01L21/205
Foreign References:
JP2010199461A | 2010-09-09 | |||
JP2013015145A | 2013-01-24 | |||
JPS57204118A | 1982-12-14 | |||
JP2009129942A | 2009-06-11 | |||
JP2009049037A | 2009-03-05 |
Attorney, Agent or Firm:
MURAKAMI, SATOSHI (JP)
Tomoji Murakami (JP)
Tomoji Murakami (JP)
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