Title:
PLASMA PROCESSING DEVICE AND METHOD OF ASSEMBLING THE PLASMA PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2002/039495
Kind Code:
A1
Abstract:
A plasma processing device, comprising a lower electrode (12) for supporting a wafer (W) inside a chamber (11), a shielding member (19) for shielding the inner peripheral surface of the chamber (11) from the plasma for processing the wafer (W), and a baffle plate (18) disposed in a space between the shielding member (19) and the lower electrode (12) and dispersedly discharging the gas inside the chamber (11), wherein a resin plate (20) is replaceably installed on the inner peripheral surface of the shielding member (19), and a compressive pressure in circumferential direction is provided to the resin plate (20).
Inventors:
TOMOYOSHI RIKI (JP)
KOIZUMI KATSUYUKI (JP)
KOIZUMI KATSUYUKI (JP)
Application Number:
PCT/JP2001/009923
Publication Date:
May 16, 2002
Filing Date:
November 13, 2001
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
TOMOYOSHI RIKI (JP)
KOIZUMI KATSUYUKI (JP)
TOMOYOSHI RIKI (JP)
KOIZUMI KATSUYUKI (JP)
International Classes:
H05H1/46; B01J19/08; C23C16/44; H01J37/32; H01L21/00; H01L21/302; H01L21/3065; (IPC1-7): H01L21/3065; H01L21/205; H01L21/31
Foreign References:
| JP2001057361A | 2001-02-27 | |||
| JPS63253628A | 1988-10-20 | |||
| JPH01107542A | 1989-04-25 | |||
| JPH0845907A | 1996-02-16 |
Attorney, Agent or Firm:
Yoshitake, Kenji (Fuji Bldg. 2-3 Marunouchi 3-chome Chiyoda-ku, Tokyo, JP)
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