Title:
PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/202432
Kind Code:
A1
Abstract:
Provided is a plasma processing device which includes a processing vessel configured such that a substrate being processed is subjected to plasma processing, a dielectric top plate which is quadrangular in a plan view and which is provided in such a way as to close an upper opening in the processing vessel, and a conductor plate which supports the dielectric top plate and which has electromagnetic wave emitting ports for emitting electromagnetic waves to the dielectric top plate, wherein: the electromagnetic wave emitting ports have a rectangular shape having long edges and short edges in a plan view; and there are four of the electromagnetic wave emitting ports, which are arranged in such a way that the long edges of the four electromagnetic wave emitting ports are each parallel to the closest edge among four edges of the dielectric top plate forming the quadrangular shape, and the long edges of the electromagnetic wave emitting ports of which the long edges are oriented in the same direction do not overlap one another in said same direction.
Inventors:
IKEDA TARO (JP)
ASHIDA MITSUTOSHI (JP)
KAMATA EIKI (JP)
ASHIDA MITSUTOSHI (JP)
KAMATA EIKI (JP)
Application Number:
PCT/JP2022/011208
Publication Date:
September 29, 2022
Filing Date:
March 14, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H05H1/46; C23C16/511; H01L21/3065; H01L21/31
Foreign References:
| JP2005317462A | 2005-11-10 | |||
| JP2014017121A | 2014-01-30 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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