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Title:
PLASMA PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/073449
Kind Code:
A1
Abstract:
Provided is a plasma processing device wherein uneven plasma density distribution can be corrected and a substrate can be made uniform. The plasma processing device is configured so that a substrate placed inside a decompression vessel is plasma processed. The decompression vessel is constituted by an electricity supply vessel around the exterior of which a circular antenna is disposed and in which plasma is generated, and a processing vessel which communicates with the interior of the electricity supply vessel and in which a substrate is disposed. Inside the electricity supply vessel, plasma is generated by high-frequency power supplied by the circular antenna. The generated plasma disperses into the processing vessel by way of a magnetic field from a solenoid coil disposed at the outer periphery of the circular antenna. Using an orientation adjustment means that adjusts inclination of this solenoid coil with respect to the processing substrate, the inclination of the magnetic field generated by the solenoid coil is adjusted and substrate processing is performed.

Inventors:
IKEDA MASAYOSHI (JP)
SAKAMOTO KIYOTAKA (JP)
SAWADA AKIHIRO (JP)
SAGO YASUMI (JP)
HASEGAWA MASAMI (JP)
KURITA MOTOZO (JP)
Application Number:
PCT/JP2011/006459
Publication Date:
June 07, 2012
Filing Date:
November 21, 2011
Export Citation:
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Assignee:
CANON ANELVA CORP (JP)
IKEDA MASAYOSHI (JP)
SAKAMOTO KIYOTAKA (JP)
SAWADA AKIHIRO (JP)
SAGO YASUMI (JP)
HASEGAWA MASAMI (JP)
KURITA MOTOZO (JP)
International Classes:
H01L21/3065; H05H1/46
Foreign References:
JP2009535852A2009-10-01
JPH10172790A1998-06-26
JP2004172243A2004-06-17
JP2008516426A2008-05-15
JP2000012294A2000-01-14
JPH11340200A1999-12-10
JPH1083896A1998-03-31
Attorney, Agent or Firm:
OKABE, Yuzuru et al. (JP)
Okabe 讓 (JP)
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Claims:



 
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