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Patent Searching and Data


Title:
PLASMA REACTION DEVICE FOR PROCESSING WORKPIECES
Document Type and Number:
WIPO Patent Application WO/2018/218797
Kind Code:
A1
Abstract:
The present invention provides a plasma reaction device for processing workpieces, the plasma reaction device comprising: an electron beam generating chamber, a filtering device and a process chamber. The electron beam generating chamber is located outside the process chamber and is in communication with the process chamber by means of the filtering device, and the electron beam generating chamber comprises an inductively coupled plasma source, the inductively coupled plasma source being used to generate a first plasma. The filtering device is used to cause the first plasma, when entering the process chamber by means of the filtering device, to generate an electron beam, the electron beam is used to excite the process gas in the process chamber to generate a second plasma, and the second plasma is used to process workpieces. The plasma reaction device for processing workpieces provided by the present invention can reduce the electron temperature, thereby solving the problem of the surfaces of workpieces being damaged due to the electron temperature being too high.

Inventors:
LI XINGCUN (CN)
Application Number:
PCT/CN2017/100466
Publication Date:
December 06, 2018
Filing Date:
September 05, 2017
Export Citation:
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Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
H01J37/32
Foreign References:
CN101999155A2011-03-30
CN103155103A2013-06-12
CN103766003A2014-04-30
US5350480A1994-09-27
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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