PLASMA-RESISTANT GLASS, CHAMBER INNER PART FOR SEMICONDUCTOR MANUFACTURING PROCESS, AND MANUFACTURING METHODS THEREFOR

Title:

PLASMA-RESISTANT GLASS, CHAMBER INNER PART FOR SEMICONDUCTOR MANUFACTURING PROCESS, AND MANUFACTURING METHODS THEREFOR

Document Type and Number:

WIPO Patent Application WO/2024/071636

Kind Code:

A1

Abstract:

The present invention relates to a plasma-resistant glass, a chamber inner part for a semiconductor manufacturing process, and manufacturing methods therefor and, specifically, to a plasma-resistant glass, a chamber inner part for a semiconductor manufacturing process, and manufacturing methods therefor, wherein the plasma-resistant glass has a low melting temperature by adjustment of the contents of plasma-resistant glass components, enables the prevention of damage caused by thermal shock during the use at high temperatures through the reduction in the coefficient of thermal expansion, has enhanced light transmittance and durability along with an appropriate dielectric constant, and attains improved moldability by adjustment of the viscosity of a molten material.

Inventors:

JEON SEO YEON (KR)
LEE KYUNG MIN (KR)
SEOK HYE WON (KR)
KIM DAE GEAN (KR)

Application Number:

PCT/KR2023/011266

Publication Date:

April 04, 2024

Filing Date:

August 01, 2023

Export Citation:

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Assignee:

HANSOL IONES CO LTD (KR)

International Classes:

C03C3/095; C03B19/09; C03B25/02; C03C3/11; C03C4/00

Foreign References:

KR20180080429A	2018-07-12
KR20220047136A	2022-04-15
KR20080085087A	2008-09-22
KR20110009862A	2011-01-31

Other References:

A AHMADI KORDLAR: "Optical Properties and Crystallization Behavior of SiO2-Al2O3-BaO-BaF2 Glasses Containing Different Amounts of Bi2O3", ADVANCED CERAMICS PROGRESS, vol. 7, no. 2, 1 January 2021 (2021-01-01), pages 34 - 43, XP093156485, DOI: 10.30501/ACP.2021.287637.1063