Title:
PLASMA TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2022/224795
Kind Code:
A1
Abstract:
The disclosed plasma treatment device is such that a substrate support part has a base and a dielectric part. The base includes a base member and an electrode. The base member is formed from a dielectric or an insulator. The electrode is formed on an upper surface of the base member. The electrode constitutes an upper surface of the base. The dielectric part provides a support surface having a substrate placed thereon. The dielectric part extends from the upper surface of the base to the support surface and is formed only from a dielectric. A bias power supply and a chuck power supply are electrically connected to the electrode of the base.
Inventors:
KOSHIMIZU CHISHIO (JP)
Application Number:
PCT/JP2022/016485
Publication Date:
October 27, 2022
Filing Date:
March 31, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H05H1/46; C23C16/458; H01L21/205; H01L21/3065
Domestic Patent References:
| WO2020159674A1 | 2020-08-06 |
Foreign References:
| JP2020534668A | 2020-11-26 | |||
| JP2020115541A | 2020-07-30 | |||
| JP2021044540A | 2021-03-18 | |||
| JP2020205444A | 2020-12-24 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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