PLASMA TREATMENT DEVICE

WIPO Patent Application WO/2014/069087

A1

Disclosed is a plasma treatment device in which power loss in the power supply line and the matching unit can be reduced. The plasma treatment device (100) is provided with: a plurality of plasma processors (3); a matching unit (4) for performing impedance matching between the plasma load of the plurality of plasma processors (3) and a high-frequency power source unit (2); and a power supply unit (5) for supplying, to the plurality of plasma processors (3), high-frequency power impedance-matched by the matching unit (4). The power supply unit (5) has an inductive coupler (6) for supplying high-frequency power using inductive coupling to each of the plurality of plasma processors (3). The inductive coupler (6) has a linear primary-side power supply rod (7) to which high-frequency power is supplied through the output of the matching unit (4) from the high-frequency power source unit (2), and a plurality of secondary-side coils (8) for generating an induced electromotive force by a high-frequency variable magnetic flux generated around the primary-side power supply rod (7) and supplying the induced current generated by the induced electromotive force to each of the plurality of plasma processors (3).

YAMAZAWA YOHEI (JP)
YAMAWAKU JUN (JP)
KOSHIMIZU CHISHIO (JP)
KIMURA TAKAFUMI (JP)

PCT/JP2013/073303

May 08, 2014

August 30, 2013

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TOKYO ELECTRON LTD (JP)

H05H1/46

JP3010443U	1995-05-02
JP2009105030A	2009-05-14
JP2012074200A	2012-04-12
JP2003506888A	2003-02-18
JP2002501577A	2002-01-15

TAKAYAMA HIROSHI (JP)
Hiroshi Takayama (JP)

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