Title:
PLASMA TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/017531
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a plasma treatment device with which, for a film formed on a substrate, a film deposition rate and film thickness can be made uniform. The plasma treatment device (1) is provided with: multiple plasma-generating antennas (20) disposed inside a vacuum chamber (10); and multiple groups of gas injection ports (30) disposed in the vicinity of lines (L1) substantially perpendicular to the longitudinal directions (D1) of the multiple antennas (20) and extending in a direction in which the multiple antennas (20) are arranged with respect to each other. The plasma treatment device is further provided with a gas flow rate control unit for controlling flow rates of gas to be injected from the groups of gas injection ports (30).
Inventors:
SAKAI TOSHIHIKO (JP)
AZUMA DAISUKE (JP)
NAKATA SEIJI (JP)
ANDO YASUNORI (JP)
AZUMA DAISUKE (JP)
NAKATA SEIJI (JP)
ANDO YASUNORI (JP)
Application Number:
PCT/JP2019/028023
Publication Date:
January 23, 2020
Filing Date:
July 17, 2019
Export Citation:
Assignee:
NISSIN ELECTRIC CO LTD (JP)
International Classes:
H05H1/46; C23C14/54; C23C16/455; C23C16/509; C23C16/52; H01L21/205; H01L21/3065
Domestic Patent References:
WO2010058560A1 | 2010-05-27 |
Foreign References:
JP2009238898A | 2009-10-15 | |||
JP2017010820A | 2017-01-12 | |||
JP2007273818A | 2007-10-18 | |||
JP2007273773A | 2007-10-18 | |||
JP2008053650A | 2008-03-06 | |||
US20050199186A1 | 2005-09-15 |
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