PLASMA TREATMENT METHOD AND PLASMA TREATMENT DEVICE

WIPO Patent Application WO/2019/009092

A1

[Problem] The present invention addresses the problem of improving productivity. [Solution] The plasma treatment according to the present invention includes heating a substrate supporting table to a first temperature, said substrate supporting table being disposed in a vacuum container. Under first discharge conditions, first plasma is generated between the substrate supporting table and a shower plate facing the substrate supporting table, and the shower plate is heated due to the first plasma and heat of the substrate supporting table. The temperature of the shower plate is monitored in a non-contact manner. After the temperature of the shower plate reaches a second temperature that is higher than the temperature heated by the heat of the substrate supporting table, a process gas is jetted toward the substrate supporting table from the shower plate, and under second discharge conditions, second plasma is generated between the substrate supporting table and the shower plate, thereby treating, using the second plasma, the substrate supported by the substrate supporting table.

KIKUCHI TORU (JP)
JINBO YOSUKE (JP)
CHATANI HIRONORI (JP)
NISHIKATA OSAMU (JP)
KAMESAKI KOUJI (JP)

PCT/JP2018/023662

January 10, 2019

June 21, 2018

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ULVAC INC (JP)

H01L21/31; C23C16/52; H01L21/3065; H05H1/46

JP2011054801A	2011-03-17
JP2013115268A	2013-06-10
JP2003282462A	2003-10-03
JP2006128380A	2006-05-18
JP2005244065A	2005-09-08
JPS61104080A	1986-05-22
JP2010141104A	2010-06-24

OMORI, Junichi (JP)

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