Title:
PLASTIC MOLDED PRODUCT COMPRISING COPPER-BASED COMPOUND MICROPARTICLES AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2014/115965
Kind Code:
A1
Abstract:
Provided are: a plastic molded product comprising copper-based compound microparticles which is relatively cheap, can be easily processed, is economical and has production efficiency; and a preparation method therefor. The molded product comprises a thermoplastic resin in which copper-based nanoparticles having an average diameter of 20-500 nm are dispersed, wherein the copper-based nanoparticles are represented by chemical structure CuxMy (wherein M is any one selected from groups 15-17 elements in the periodic table, and x/y = 0.8-1.2), and are generated from copper sulfate and any one selected from a sulfate, a fluoride and a chloride in a molar ratio of 1:1 in an aqueous solution at 50-80℃.
Inventors:
BAEK SEUNG WOO (KR)
KIM MUN SUN (KR)
KIM MUN SUN (KR)
Application Number:
PCT/KR2013/011690
Publication Date:
July 31, 2014
Filing Date:
December 17, 2013
Export Citation:
Assignee:
BS SUPPORT CO LTD (KR)
International Classes:
C08K3/30; A61J1/00; B29C48/07; B29C48/91; C08J5/00; C08K3/08; C08L101/00
Foreign References:
| KR20090102742A | 2009-09-30 | |||
| US7960465B2 | 2011-06-14 | |||
| EP0677989A1 | 1995-10-25 | |||
| KR100962268B1 | 2010-06-11 | |||
| KR20080008814A | 2008-01-24 |
Attorney, Agent or Firm:
AHN, SEUNG TAE (KR)
안승태 (KR)
안승태 (KR)
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