Title:
PLATE FORMING METHOD AND PLATE FORMING DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/054527
Kind Code:
A1
Abstract:
Provided is a plate forming method and plate forming device capable of processing a plate with high precision when forming a plate by local heating. This plate forming method is characterized by comprising: a compression step (S3) of bending a titanium material plate by pressing the same against a mold in a situation where a tensile load is applied so that a prescribed tensile stress is generated on the plate; a preforming step (S5) of locally stretching the portions of the plate that are contacting the mold so that portions floating from the mold contact the mold; a contact inspection/determination step (S6, S7) of inspecting and determining whether the plate is contacting the mold; and a primary forming step (S9) of forming the entire plate by heating the same to a temperature where plastic deformation thereof starts and stretching to an extent where the shape is deformed does not occur.
Inventors:
SATO HIROAKI (JP)
ABE KUNIHIKO (JP)
ABE KUNIHIKO (JP)
Application Number:
PCT/JP2013/076252
Publication Date:
April 10, 2014
Filing Date:
September 27, 2013
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B21D25/02; B21D9/18; B21D31/06; B21D53/92
Domestic Patent References:
| WO2012120989A1 | 2012-09-13 |
Foreign References:
| JPS55103220A | 1980-08-07 | |||
| JP2010214468A | 2010-09-30 | |||
| US6601426B2 | 2003-08-05 |
Attorney, Agent or Firm:
FUJITA, Takaharu et al. (JP)
Takaharu Fujita (JP)
Takaharu Fujita (JP)
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