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Patent Searching and Data


Title:
PLATE-LIKE WORK POLISHING APPARATUS AND METHOD OF POLISHING PLATE-LIKE WORK
Document Type and Number:
WIPO Patent Application WO/2004/073924
Kind Code:
A1
Abstract:
A plate-like work polishing apparatus for polishing a thin plate-like work such as a printed circuit board material by buff rollers, comprising a guide member guiding the plate-like work passed through a clearance between the buff rollers and backup rollers to carrying rollers, wherein the plate-like work is prevented from being broken due to the bending of the thin plate-like work when the surfaces thereof are polished by the buff rollers by stopping the rotation of the buff rollers during the carrying of the plate-like sheet or reversely rotating the buff rollers. Also, the apparatus comprises a shielding member preventing water splash including swarf sludge produced in a polishing roller assembly from being splashed at least in a work carrying direction and a feed passage feeding water splashed on the shielding member to the outside of the apparatus. Thus, the occurrence of recessed scratches and dents can be prevented, and the cause of a trouble with electrical connection performed through the interlayer holes of the printed circuit board can be eliminated.

Inventors:
SUZUKI TOSHIHIRO (JP)
SUZUKI NOBUHIKO (JP)
TASHIRO YUTAKA (JP)
Application Number:
PCT/JP2004/001758
Publication Date:
September 02, 2004
Filing Date:
February 17, 2004
Export Citation:
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Assignee:
TECHNOPRO MARUGEN CO LTD (JP)
YAMANASHI MATSUSHITA ELECTRIC (JP)
SUZUKI TOSHIHIRO (JP)
SUZUKI NOBUHIKO (JP)
TASHIRO YUTAKA (JP)
International Classes:
B24B29/00; B23Q11/08; B24B7/12; B24B29/06; H05K3/26; (IPC1-7): B24B29/00; B23Q11/00; B24B41/06
Foreign References:
JPH0621279U1994-03-18
JPS59110549A1984-06-26
JP2001328046A2001-11-27
JPH06126611A1994-05-10
JPS5924951A1984-02-08
Attorney, Agent or Firm:
Yoshikawa, Koji (Shinkawa 1-chome Shizuoka-shi, Shizuoka, JP)
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