Title:
PLATE MATERIAL BENDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/127288
Kind Code:
A1
Abstract:
[Problem] To provide a plate material bending device that can perform a bending process on an end portion of a plate material even when the plate material has a bent portion that faces downward. [Solution] The present invention is characterized by having a table for mounting a plate material, a manipulator that clamps the plate material and is controlled so as to advance, retract, and turn, and a bending machine for bending an end portion of the plate material, wherein the table is divided into multiple divided tables, and one or more of the multiple divided tables can be lowered below the upper surface of the other divided tables.
Inventors:
YOSHIDA DAISUKE (JP)
Application Number:
PCT/JP2022/040648
Publication Date:
July 06, 2023
Filing Date:
October 31, 2022
Export Citation:
Assignee:
KYOWA MACHINE TECH CO LTD (JP)
International Classes:
B21D5/01; B21D5/04; B21D43/00
Domestic Patent References:
| WO2019171561A1 | 2019-09-12 |
Foreign References:
| JP2001079614A | 2001-03-27 | |||
| JP2000237822A | 2000-09-05 | |||
| JP2005040829A | 2005-02-17 | |||
| JP2000280025A | 2000-10-10 |
Attorney, Agent or Firm:
OTANI Kaichi (JP)
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