Title:
PLATE-SHAPED SOLDER MANUFACTURING METHOD AND MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/033975
Kind Code:
A1
Abstract:
A plate-shaped solder manufacturing method according to the present application is provided with: a grouping step of grouping a plurality of thread solders together; and a pressure bonding step of pressure bonding the grouped plurality of thread solders to one another to form plate-shaped solder. A plate-shaped solder manufacturing device according to the present application is provided with: a grouping unit for grouping a plurality of thread solders together; and a pressure bonding unit for pressure bonding the plurality of thread solders to one another in the grouping unit to form plate-shaped solder.
Inventors:
UOZUMI SHUJI (JP)
SAKUTANI KAZUHIKO (JP)
SAKUTANI KAZUHIKO (JP)
Application Number:
PCT/JP2016/074018
Publication Date:
February 22, 2018
Filing Date:
August 17, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K35/40; B23K35/14
Foreign References:
| US6386426B1 | 2002-05-14 | |||
| JPS61269997A | 1986-11-29 | |||
| JPH06132645A | 1994-05-13 |
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
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