Title:
PLATE FOR A SHIELD CAN FOR AN SMD PROCESS, MANUFACTURING METHOD THEREOF, AND SHIELD CAN USING THE PLATE
Document Type and Number:
WIPO Patent Application WO/2012/141394
Kind Code:
A1
Abstract:
The present invention relates to a plate for a shield can which has superior heat resistance and insulation and is used as a mother material for the shield can for blocking electromagnetic waves of electronic components, a manufacturing method thereof, and a shield can mounted on a printed circuit board (PCB) to cover the electronic components disposed on the PCB through working the sheet metal of the plate. The plate for a shield can includes: a conductive layer formed of at least one clad metal of copper (Cu), zinc (Zn), nickel (Ni), silver (Ag), iron (Fe), chrome (Cr), and an alloy thereof; and an insulation layer laminated on one surface of the conductive layer formed of a mixture of one or more materials of thermal plastic polyester resins such as PET, PBT, PTT, PCT, and PEN. The shield can which is manufactured using the above-described plate for a shield can to cover the electronic components mounted on the PCB may have a cover shape in which the conductive layer is exposed to the outside, and the insulation layer covers the electronic components to face electronic component devices. Also, the shield can may be soldered to the PCB.
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Inventors:
SONG MIN HWA (KR)
OH EUN GYO (KR)
OH EUN GYO (KR)
Application Number:
PCT/KR2011/007388
Publication Date:
October 18, 2012
Filing Date:
October 06, 2011
Export Citation:
Assignee:
SONG MIN HWA (KR)
OH EUN GYO (KR)
OH EUN GYO (KR)
International Classes:
H05K9/00; B32B15/08
Foreign References:
| JPH0227800A | 1990-01-30 | |||
| KR20060134192A | 2006-12-27 | |||
| JP2006156609A | 2006-06-15 | |||
| JP2009111410A | 2009-05-21 | |||
| JP2001274587A | 2001-10-05 |
Attorney, Agent or Firm:
JEON, JONG HAG (KR)
전종학 (KR)
전종학 (KR)
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Claims: