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Title:
PLATE THICKNESS CONTROL DEVICE, AND PLATE THICKNESS CONTROL METHOD
Document Type and Number:
WIPO Patent Application WO/2020/250424
Kind Code:
A1
Abstract:
This plate thickness control device is a plate thickness control device for performing plate thickness control of a hot rolling mill provided with a rolling stand. The plate thickness control device is provided with: a thermometer disposed on an entry side of the rolling stand; a difference computing unit for outputting a differential temperature between a lock-on temperature of a rolled plate, measured by the thermometer, and a measured value relating to a part other than a distal end portion of the rolled plate, measured by the thermometer; a tracking unit for transferring the differential temperature from the position of the thermometer to directly below the rolling stand, on the basis of the plate speed of the rolled plate; and a calculating unit for calculating an amount of reduction at the rolling stand on the basis of the differential temperature transmitted from the tracking unit. The calculating unit may include: a proportional differential control unit for implementing proportional differential control with respect to the differential temperature; and a reduction amount computing unit for calculating the amount of reduction on the basis of an output value from the proportional differential control unit.

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Inventors:
TACHIBANA MINORU (JP)
Application Number:
PCT/JP2019/023668
Publication Date:
December 17, 2020
Filing Date:
June 14, 2019
Export Citation:
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Assignee:
TOSHIBA MITSUBISHI ELEC IND (JP)
International Classes:
B21B37/18; B21B1/26
Domestic Patent References:
WO2011132273A12011-10-27
Foreign References:
JPS52142650A1977-11-28
JPS62263817A1987-11-16
JPH09253723A1997-09-30
JPH08255003A1996-10-01
JP2000288613A2000-10-17
JPH02169120A1990-06-29
JPH04313412A1992-11-05
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
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