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Patent Searching and Data


Title:
PLATED ARTICLE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2013/094766
Kind Code:
A1
Abstract:
A plated article comprising a multi-layer plating film formed on top of a conductive-metal substrate. Said plated article is characterized by having the following on top of the aforementioned substrate, in this order: a porous plating layer consisting primarily of nickel or copper; and a surface plating layer consisting primarily of gold or silver. This plated article is further characterized in that a large number of holes are formed in the surface of the multi-layer plating film. The plated article preferably also has an oxide layer comprising a nickel oxide or a copper oxide between the porous plating layer and the surface plating layer. It is also preferable that the surface plating layer is thinner where the aforementioned holes are than where bumps are. This makes it possible to provide a low-cost, highly corrosion-resistant plated article.

Inventors:
TAKAMIZAWA MASAO (JP)
NISHIMURA YOSHIYUKI (JP)
Application Number:
JP2012/083371
Publication Date:
June 27, 2013
Filing Date:
December 22, 2012
Export Citation:
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Assignee:
OM SANGYO CO LTD (JP)
International Classes:
C25D5/12; C25D7/00; H01H1/04; H01H11/04; H01R13/03; H05K3/18
Foreign References:
JPH03257193A1991-11-15
JPH03291395A1991-12-20
JP2006202569A2006-08-03
JP2009117542A2009-05-28
JPH03100187A1991-04-25
JP2004339584A2004-12-02
JP2004349497A2004-12-09
JP2008106290A2008-05-08
Attorney, Agent or Firm:
NAKATSUKASA, SHIGEKI (JP)
Shigeki Nakamu (JP)
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Claims: